Topscom Precision Industry Co Limited
Products
Products
Topscom Precision Industry Co Limited
Telecom/Amplifier Product with Silkscreen/Pad Printing and Surface-mount Technology
  • Telecom/Amplifier Product with Silkscreen/Pad Printing and Surface-mount Technology
  • Telecom/Amplifier Product with Silkscreen/Pad Printing and Surface-mount Technology
Telecom/Amplifier Product with Silkscreen/Pad Printing and Surface-mount Technology
Telecom/Amplifier Product with Silkscreen/Pad Printing and Surface-mount Technology

Telecom/Amplifier Product with Silkscreen/Pad Printing and Surface-mount Technology

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Basic Info
Basic Info
Payment Type: TT or L/C at Sight
Product Description
Product Description
  • Features:
    • Plastic molding and injection
    • Sheet metal stamping and punching and stamping dies
    • Painting lines
    • Die-casting lines
    • Powder coating lines
    • Silkscreen and pad printing
    • High-speed SMT and DIP assembly
    • Chip-on-board (COB)
    • Surface-mount technology (SMT)
    • Ball-grid array (BGA)
    • Materials: ABS, PP, POM, PVC, TPR, TPU, PA and glass fiber or any specific materials upon customers' request
    • Product requirement like dual-injection, high-temperature endurance, high-hardness and others are available upon request
    • Flexible surface finishing such as chrome plating, painting, water transfer printing, texture and more are available

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      • Mr.  Frank of OEM I Factory

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