Topscom Precision Industry Co Limited
Products
Products
Topscom Precision Industry Co Limited
Telecom Hub with Silkscreen, Pad Printing and Die-casting Lines
  • Telecom Hub with Silkscreen, Pad Printing and Die-casting Lines
  • Telecom Hub with Silkscreen, Pad Printing and Die-casting Lines
  • Telecom Hub with Silkscreen, Pad Printing and Die-casting Lines
  • Telecom Hub with Silkscreen, Pad Printing and Die-casting Lines
  • Telecom Hub with Silkscreen, Pad Printing and Die-casting Lines
Telecom Hub with Silkscreen, Pad Printing and Die-casting Lines
Telecom Hub with Silkscreen, Pad Printing and Die-casting Lines
Telecom Hub with Silkscreen, Pad Printing and Die-casting Lines
Telecom Hub with Silkscreen, Pad Printing and Die-casting Lines
Telecom Hub with Silkscreen, Pad Printing and Die-casting Lines

Telecom Hub with Silkscreen, Pad Printing and Die-casting Lines

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Basic Info
Basic Info
Payment Type: TT or L/C at Sight
Product Description
Product Description
  • Chip-on-board (COB) surface-mount technology (SMT) ball-grid array (BGA) through-hole
  • Profound knowledge of contract manufacturing services
  • Capable of developing effective production process to ensure high-quality and consistency
  • Experienced logistics management
  • Well-established reputation since 1995 ISO 9001:2000
  • Cost-effective factory located in mainland China
  • Our building products experience range: industrial, automotive, computing, storage, consumer, instrumentation, medical, networking, peripherals and telecommunications

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