Poe Precision Electronics Co. Ltd
Poe Precision Electronics Co. Ltd
Multilayer HASL Lead-free Bluetooth Module PCB Assembly
  • Multilayer HASL Lead-free Bluetooth Module PCB Assembly
Multilayer HASL Lead-free Bluetooth Module PCB Assembly

Multilayer HASL Lead-free Bluetooth Module PCB Assembly

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Telegraphic Transfer in Advance (Advance TT, T/T)
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Basic Info
Basic Info
Payment Type: Telegraphic Transfer in Advance (Advance TT, T/T)
Product Description
Product Description
  • Specifications:
    • Layers: 4
    • Material: FR4
    • Thickness: 1.6mm
    • Copper thickness: 1oz
    • Minimum hole: 0.2mm
    • Minimum track width, spacing: 4 x 4mil
    • Testing points: 4,000
    • Solder mask: LPI blue
    • Silkscreen: white
    • Function: Bluetooth module
    • Finish: HASL lead-free
  • Production descriptions:
    • 4-layer Bluetooth module PCB assembly
    • Multilayer blue solder mask PCB assembly
    • High-quality FR4 HASL lead-free PCB assembly
    • Quick-turn prototype for PCB assembly
    • High-density PCB assembly with components:
  • Components:
    • LCD module: 1
    • Switch: 15
    • Pin header: 5
    • IC: 20
    • LED: 2
    • Mini USB connector: 2 
  • PCBA manufacturing:
    • Components IC sourcing
    • X-ray checking for all solder joints and BGA planting
    • SMT process with X-ray, ICT, AOI and E-test
    • ICT function and testing instruction test
    • PCBA of through-hole and surface mount technology
    • Profound knowledge of contract manufacturing service
  • Layers: 4
  • Material: FR4
  • Thickness: 1.6mm
  • Copper thickness: 1oz
  • Minimum hole: 0.2mm
  • Minimum track width, spacing: 4 x 4mil
  • Testing points: 4,000
  • Solder mask: LPI blue
  • Silkscreen: white
  • Function: Bluetooth module
  • Finish: HASL lead-free
  • 4-layer Bluetooth module PCB assembly
  • Multilayer blue solder mask PCB assembly
  • High-quality FR4 HASL lead-free PCB assembly
  • Quick-turn prototype for PCB assembly
  • High-density PCB assembly with components:
  • LCD module: 1
  • Switch: 15
  • Pin header: 5
  • IC: 20
  • LED: 2
  • Mini USB connector: 2 
  • Components IC sourcing
  • X-ray checking for all solder joints and BGA planting
  • SMT process with X-ray, ICT, AOI and E-test
  • ICT function and testing instruction test
  • PCBA of through-hole and surface mount technology
  • Profound knowledge of contract manufacturing service
  • Send your message to this supplier

    • Enter between 20 to 4,000 characters.

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