Poe Precision Electronics Co. Ltd
Poe Precision Electronics Co. Ltd
4-layer Audio Equipment PCB/Printed Circuit Board Assembly
  • 4-layer Audio Equipment PCB/Printed Circuit Board Assembly
4-layer Audio Equipment PCB/Printed Circuit Board Assembly

4-layer Audio Equipment PCB/Printed Circuit Board Assembly

Payment Type:
Telegraphic Transfer in Advance (Advance TT, T/T)
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Basic Info
Basic Info
Payment Type: Telegraphic Transfer in Advance (Advance TT, T/T)
Product Description
Product Description
  • Specifications:
    • Layer: 4
    • Material: FR-4
    • Thickness: 1.6mm
    • Copper thickness: 1oz
    • Minimum hole: 0.2mm
    • Minimum track width, spacing: 4 x 4mil
    • Testing points: 4000
    • Solder mask: LPI black
    • Silkscreen: white
    • Function: audio equipment
    • Finish: immersion gold
  • Production description:
    • High precision audio equipment PCB assembly
    • Multilayer black solder mask PCB assembly
    • 4-layer immersion gold finish PCB assembly
    • PCB assembly with components:
      • IC: 12
      • Connector: 10
      • Inductor: 20
      • Electrolytic capacitor: 16
      • Crystal: 2
      • Transformer: 1
  • PCBA manufacturing:
    • Components IC sourcing
    • X-ray checking for all solder joints and BGA planting
    • SMT process with X-ray, ICT, AOI and E-test
    • Profound knowledge of contract manufacturing service
    • PCBA of through-hole and surface mount technology
  • Layer: 4
  • Material: FR-4
  • Thickness: 1.6mm
  • Copper thickness: 1oz
  • Minimum hole: 0.2mm
  • Minimum track width, spacing: 4 x 4mil
  • Testing points: 4000
  • Solder mask: LPI black
  • Silkscreen: white
  • Function: audio equipment
  • Finish: immersion gold
  • High precision audio equipment PCB assembly
  • Multilayer black solder mask PCB assembly
  • 4-layer immersion gold finish PCB assembly
  • PCB assembly with components:
    • IC: 12
    • Connector: 10
    • Inductor: 20
    • Electrolytic capacitor: 16
    • Crystal: 2
    • Transformer: 1
  • IC: 12
  • Connector: 10
  • Inductor: 20
  • Electrolytic capacitor: 16
  • Crystal: 2
  • Transformer: 1
  • Components IC sourcing
  • X-ray checking for all solder joints and BGA planting
  • SMT process with X-ray, ICT, AOI and E-test
  • Profound knowledge of contract manufacturing service
  • PCBA of through-hole and surface mount technology
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