Hongda Technology (HK) Co. Limited
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Products
Hongda Technology (HK) Co. Limited
PCBA, Communication Product
  • PCBA, Communication Product
PCBA, Communication Product

PCBA, Communication Product

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Basic Info
Basic Info
Payment Type: Telegraphic Transfer in Advance (Advance TT, T/T)
Product Description
Product Description
  • Type of assembly:
    • THD (through-hole device)/conventional
    • SMT (surface-mounted technology)
    • SMT and THD mixed
    • Double-sided SMT and/or THD assembly components:
      • Passives minimum size: 0402
      • Fine pitch: 08 mils
      • Lead-less chip carriers/BGA, VFBGA, FPGA and DFN
      • Connectors and terminals
    • Board dimensions:
      • Minimum size: 0.25 x 0.25 inch, 6 x 6mm
      • Maximum size: 15.75 x 13.5 inches, 400 x 340mm
    • Board types: rigid, flexible and rigid-flexible
    • Solder types:
      • Leaded and lead-free
      • Water soluble solder paste
      • Manual soldering for special parts, wires and temperature sensitive parts
    • Design file formats:
      • Gerber RS274X, 274D, Eagle and AutoCAD DXF and DWG
      • BOM (bill of materials)
      • Pick and place file (XYRS)
    • Component packaging: reels, cut tape, tube and loose parts
  • THD (through-hole device)/conventional
  • SMT (surface-mounted technology)
  • SMT and THD mixed
  • Double-sided SMT and/or THD assembly components:
    • Passives minimum size: 0402
    • Fine pitch: 08 mils
    • Lead-less chip carriers/BGA, VFBGA, FPGA and DFN
    • Connectors and terminals
  • Board dimensions:
    • Minimum size: 0.25 x 0.25 inch, 6 x 6mm
    • Maximum size: 15.75 x 13.5 inches, 400 x 340mm
  • Board types: rigid, flexible and rigid-flexible
  • Solder types:
    • Leaded and lead-free
    • Water soluble solder paste
    • Manual soldering for special parts, wires and temperature sensitive parts
  • Design file formats:
    • Gerber RS274X, 274D, Eagle and AutoCAD DXF and DWG
    • BOM (bill of materials)
    • Pick and place file (XYRS)
  • Component packaging: reels, cut tape, tube and loose parts
  • Passives minimum size: 0402
  • Fine pitch: 08 mils
  • Lead-less chip carriers/BGA, VFBGA, FPGA and DFN
  • Connectors and terminals
  • Minimum size: 0.25 x 0.25 inch, 6 x 6mm
  • Maximum size: 15.75 x 13.5 inches, 400 x 340mm
  • Leaded and lead-free
  • Water soluble solder paste
  • Manual soldering for special parts, wires and temperature sensitive parts
  • Gerber RS274X, 274D, Eagle and AutoCAD DXF and DWG
  • BOM (bill of materials)
  • Pick and place file (XYRS)

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