Multilayer PCB with Immersion Gold Treatment

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Basic Info

Payment Type:	Telegraphic Transfer (TT,T/T)

Product Description

Base material: FR4

Layer coverage: multilayer

Board thickness: 2.0mm

Copper thickness: 1oz

Surface treatment: immersion gold

Minimum hole size: 0.3mm

PTH hole copper thickness: 10 to 50μm

Outer layer line width/space: 75/75μm (minimum)

Solder mask color: red

Application: industry control

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