Customized Multilayer PCB, FR4, Gold Immersion Plating PCB, E-test, High-precision

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Basic Info

Payment Type:	Telegraphic Transfer (TT,T/T)

Product Description

Materials: FR-4, Tg is 135, 150, 170, 180 and 210

Layer count: 2 to 16

Copper thickness: 1/2 (18), 1 (35) and 2oz (70μm)

Board thickness: 8 to 236mil (0.2 to 6.0mm)

Maximum panel size: 32 x 20 inches (800 x 508mm)

Minimum line width/space: 3/3mil (75/75μm)

Minimum inner layer annular ring: 4mil (0.10mm)

Minimum core thickness: 4mil (0.10mm)

Surface treating of inner layer: brown oxide

Inner layer registration: 3mil (76μm)

Tolerance of board thickness: ±12 to 10%

Minimum drill size: 8mil (0.2mm)

Minimum HDI laser drill size: 3mil (0.076mm)

Tolerance of hole size: 2mil (0.05mm)

Tolerance of hole position: 2mil (0.05mm)

Maximum aspect ratio: 10:01

PTH copper thickness: 1mil (25μm)

Solder mask colors: green, blue, yellow, white and black

Solder mask thickness: 5 to 30μm

Solder mask hardness: 6H

Minimum solder mask dam: 3mil (75μm)

Maximum hole size of S/M plug: 24mil (0.6mm)

Peelable solder mask: supported

Carbon ink: supported

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