BGA Gold Plating Multilayer Mobile Phone Printed Circuit Board

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Basic Info

Payment Type:	Telegraphic Transfer (TT,T/T)

Product Description

Number of layers: eight layer

Major material: FR-4, CEM-3 (other materials upon request)

Minimum board thickness: double side: 0.2mm (7.8 mil)

Maximum board thickness: 2.4mm (95 mil)

Surface finishing: flash gold plating

Immersion gold (maximum 0.5 micrometer)

Thick gold plating (maximum 1.0 micrometer)

Hot-air solder leveling

Entek coating (OSP)

Solder mask: LPI (wet film), thermal cured type

Other print: carbon print, peelable solder mask

Solder mask plugged hole

Copper thickness (finishing): 1/2oz (18 micrometer) to 4oz (140 micrometer)

Minimum hole size: 0.3mm (12 mil)

Hold size tolerance (NPTH): +/- 0.076mm (3 mil)

Minimum line width and spacing: 0.1mm (4 mil)

Minimum solder mask clearance: 0.076mm (3 mil)

Minimum annular ring: 0.076mm (3 mil)

Profile and v-cut: V-cut, jump v-cut and CNC v-cut

CNC-routing, stamping and beveling

Special process: blind/buried via hole

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