Multilayer PCB with 6/6oz Maximum Surface Copper Thickness, RoHS Directive-compliant

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Basic Info

Payment Type:	Telegraphic Transfer (TT,T/T)

Product Description

Base materials: high temperature FR4/FR5, free halogen FR4, aluminum based, polyimide, rogers, arlon and other teflon/PTFE

Layers: 1 to 30 layers standard PCB

Blind vias and buried vias board

Minimum track space: 4/4 mil and 3 mils partial allowed

Maximum size: 1000 x 1200mm

Minimum size: 3 x 3mm

Surface copper thickness:

Maximum: 6/6oz
Minimum: 0.5/0.5oz

Hard gold thickness: (maximum) 50μ

Maximum board thickness: 6.0mm

Finishes: SMOBC/HASL, lead free SMOBC/HASL, organic OSP, hard and soft gold, plating tin, immersion silver, immersion tin and electroless nickel/immersion gold

Maximum: 6/6oz

Minimum: 0.5/0.5oz

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