Sun Light PCB & Technologies Ltd
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Sun Light PCB & Technologies Ltd
High-density 12-layer, FR4 PCBs 1.8mm Thickness and Chem Ni/Au for Cellphone PCB
  • High-density 12-layer, FR4 PCBs 1.8mm Thickness and Chem Ni/Au for Cellphone PCB
High-density 12-layer, FR4 PCBs 1.8mm Thickness and Chem Ni/Au for Cellphone PCB

High-density 12-layer, FR4 PCBs 1.8mm Thickness and Chem Ni/Au for Cellphone PCB

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Basic Info
Basic Info
Payment Type: T/T in Advance, Cash or 50% Deposit and 50% on Del
Product Description
Product Description
  • Layer: 12 HDI 2+8+2
  • Material: FR4 Tg170
  • laser: 1-2L, 2-3L, 10-11L, 11-12L, 0.1mm
  • Thickness board: 1.8mm, ±10%
  • Outer finish copper: 35um
  • Inner copper: 35um
  • Minimum L/W: 0.15/0.15mm
  • Minimum holes: 0.2mm
  • Hole copper thickness: 25um
  • Surface finish: ENIG
  • 100% E-test

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