SMT Assembly with In-house IPC-610-D Standard

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Basic Info

Payment Type:	Telegraphic Transfer (TT,T/T)

Product Description

SMT Assembly and through-hole/DIP

In-circuit test

Minimum size of component: 0201

Minimum IC space: 0.3mm

Minimum BGA pitch: 0.5mm (with ball diameter of 0.3mm)

QFP: 0.4 pitch

With in-house IPC-610-D standard

Provides OEM services to all sorts of printed circuit board assembly

Advanced equipment

Experienced PCB and PCBA manufacturer in Shenzhen, China

We are dedicated to providing you with reliable board-level assemblies and full box builds

From SMT/PTH assemblies with multilayer boards to full box builds using plastic or metal enclosures, we have the manufacturing capabilities

We can also provide cable assemblies and component procurement services for active, passive and mechanical components to reduce your costs and lead times

With efficient production and procurement processes that are backed by stringent QC measures, we can ensure high-performance products for your volume orders

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