
PCB assembly
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Basic Info
Payment Type: | Telegraphic Transfer (TT,T/T) |
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Product Description
Product Description
- Surface-mounting technology (SMT) and through-hole/DIP
- Chip on Board ( COB servic)
- In-circuit test
- Minimum size of component: 0201
- Minimum IC space: 0.3mm
- Minimum BGA pitch: 0.5mm (with ball diameter of 0.3mm)
- QFP: 0.4 pitch
- With in-house IPC-610-D standard
- Provides OEM services to all sorts of printed circuit board assembly
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