Modulelink (Shenzhen) Technology Co. Ltd
Modulelink (Shenzhen) Technology Co. Ltd
GLC-BX-D/U SFP bidi, 20km, with low power dissipation
  • GLC-BX-D/U SFP bidi, 20km, with low power dissipation
  • GLC-BX-D/U SFP bidi, 20km, with low power dissipation
GLC-BX-D/U SFP bidi, 20km, with low power dissipation
GLC-BX-D/U SFP bidi, 20km, with low power dissipation

GLC-BX-D/U SFP bidi, 20km, with low power dissipation

Payment Type:
Telegraphic Transfer in Advance (Advance TT, T/T)
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Basic Info
Basic Info
Payment Type: Telegraphic Transfer in Advance (Advance TT, T/T)
Product Description
Product Description
  • Up to 1.25 Gb/s bi-directional data links
  • ot-pluggable SFP footprint
  • 1310nm FP Transmitter and 1550 PIN Receiver for MSFP-1.25G-BIDI20-R
  • 1550 DFB Transmitter and 1310 PIN Receiver for MSFP-1.25G-BIDI20-T
  • Single LC connector 
  • Low power dissipation
  • Metal enclosure, for lower EMI 
  • Up to 20km point to point transmission
  • Digital diagnostical Management support
  • Single 3.3V power supply 
  • Compatible with SFP MSA
  • Operating temperature range: 0 to 70 deg. C
  • Applications:  
    • Ethernet
    • Point-to-point FTTX Application
  • Ethernet
  • Point-to-point FTTX Application
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