Modulelink (Shenzhen) Technology Co. Ltd
Modulelink (Shenzhen) Technology Co. Ltd
10GB XENPAK ER Transponder XENPAK
  • 10GB XENPAK ER Transponder XENPAK
10GB XENPAK ER Transponder XENPAK

10GB XENPAK ER Transponder XENPAK

Payment Type:
Telegraphic Transfer in Advance (Advance TT, T/T)
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Basic Info
Basic Info
Payment Type: Telegraphic Transfer in Advance (Advance TT, T/T)
Product Description
Product Description
  • Features:
    • XAUI electrical interface: 4 Lanes @ 3.125Gbit/s
    • Hot Z-pluggable
    • SC-Duplex optical receptacle
    • MDIO, DOM support
    • Cooled 1550nm EML
    • Pin photo-detector
    • Operating case temperatures: 0 to 70 °C
    • Compliant to IEEE 802.3ae 10GBASE-ER application
    • Compliant to XENPAK MSA
    • Mechanical footprint: 4.76” L x 1.42” W x 0.46” H
  • XAUI electrical interface: 4 Lanes @ 3.125Gbit/s
  • Hot Z-pluggable
  • SC-Duplex optical receptacle
  • MDIO, DOM support
  • Cooled 1550nm EML
  • Pin photo-detector
  • Operating case temperatures: 0 to 70 °C
  • Compliant to IEEE 802.3ae 10GBASE-ER application
  • Compliant to XENPAK MSA
  • Mechanical footprint: 4.76” L x 1.42” W x 0.46” H
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