Shenzhen Sinetech Electronic Co. Ltd
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Shenzhen Sinetech Electronic Co. Ltd
Four Layered PCB Assembly with 0.15mm QFP Pitch, Tin Plating Surface Technique and Lead-free
  • Four Layered PCB Assembly with 0.15mm QFP Pitch, Tin Plating Surface Technique and Lead-free
Four Layered PCB Assembly with 0.15mm QFP Pitch, Tin Plating Surface Technique and Lead-free

Four Layered PCB Assembly with 0.15mm QFP Pitch, Tin Plating Surface Technique and Lead-free

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Basic Info
Basic Info
Payment Type: T/T
Product Description
Product Description
  • Material: FR4
  • 0.3mm QFP pitch
  • Layer count: 4
  • Board thickness: 1.6mm
  • Surface technique: HAL lead-free
  • Minimum hole size: 0.15mm
  • Copper thickness: 1.0z
  • Solder mask: green
  • Application field: electronic appliance board

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