8L PC Board with Immersion Gold, Blind and Buried Via, BGA

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Basic Info

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Product Description

Base material:

Craft-ability table:

Board thickness: 1.6mm

Layers: 8

Minimum line width/spacing: 4 mils

Minimum hole diameter: 0.3mm

Finish copper thickness: 1oz

Surface finish: Immersion gold

Solder mask: green

Minimum line width/spacing: 0.075/0.075mm

Minimum solder mask dam: 0.075mm

Minimum and maximum board thickness: 0.2-3.5mm

Maximum finish copper thickness: 0.5-4oz

Maximum layers count: 8

Impedance control: ±8%

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