6-layers High-density Multilayer PCBs with 2 Times Buried and Blind Vias

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Basic Info

Payment Type:	Telegraphic Transfer in Advance (Advance TT, T/T)

Product Description

6-layer HDI PCB with 2 times buried and blind vias

Board thickness: 1.60mm +/-10%

Copper thickness: 1oz

Min holes: 0.10mm (L1 to L2, L2 to L3, L2 to L5, L5 to L6 )

Min line width/gap: 4/4mil

Special process: 1.40mm deep controlled N-plated holes

Surface treatment: ENIG

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