Smart Power Industry (H.K.) Co.,Ltd
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Smart Power Industry (H.K.) Co.,Ltd
8-layered Main Board for Mobile Phones, with OSP BGA Surface Finish
  • 8-layered Main Board for Mobile Phones, with OSP BGA Surface Finish
8-layered Main Board for Mobile Phones, with OSP BGA Surface Finish

8-layered Main Board for Mobile Phones, with OSP BGA Surface Finish

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Basic Info
Basic Info
Payment Type: T/T, L/C, Western Union, PayPal
Product Description
Product Description
  • 8-layer main board for mobile phone
  • Minimum line width/space: 3mils
  • Surface finish: immersion gold
  • BGA surface finish: OSP
  • Board thickness: 39.4mils
  • Minimum drilled hole diameter: 5mils
  • Minimum BGA PAD size: 10mils
  • Copper thickness: 1/2oz
  • Impedance: 50©, ±10%

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