2-layer Gold-plated PCB with Bonding IC, Made of FR-4

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Basic Info

Payment Type:	Telegraphic Transfer in Advance (Advance TT, T/T)

Product Description

2-layer gold-plated PCB with bonding IC

Minimum line width/space: 5 mils

Board thickness: 39.4 mils

Material: FR-4

Minimum drilled hole diameter: 20 mils

Copper thickness: 1oz

Gold thickness of bonding IC: 20 to 30 mils

Line width/gap of the bonding IC: 2 to 3 mils

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