
PCB Assembly, Double-side, Made of Copper, RoHS Directive-compliant
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- Telegraphic Transfer in Advance (Advance TT, T/T)
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Basic Info
Payment Type: | Telegraphic Transfer in Advance (Advance TT, T/T) |
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Product Description
Product Description
- Re-layouts
- Bare PCB and FPC fabrication
- Components procurement
- Assemble the boards, SMT, BGA, and DIP
- Mechanical testing
- Functional testing
- Inspection of finished products
- Wire harnesses and cable assembly
- Case, housing, and rubber molding assembly
- Complies with IPC-A-160 soldering standard
- IC pitch: 0.2mm (8mil)
- BGA and CSP pitch: 0.2mm
- SMT, PTH, and box build
- Single, double side re-flow
- Glue: supported
- Nitrogen re-flow/wave: supported
- Process: clean, no clean, and lead-free
- Baking oven: supported
- BGA inspection/rework: supported
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