Succeedin Summer Corp. Ltd
Succeedin Summer Corp. Ltd
PCB Circuit Board, Assemble the Boards, SMT/BGA/DIP and Functional Testing
  • PCB Circuit Board, Assemble the Boards, SMT/BGA/DIP and Functional Testing
  • PCB Circuit Board, Assemble the Boards, SMT/BGA/DIP and Functional Testing
  • PCB Circuit Board, Assemble the Boards, SMT/BGA/DIP and Functional Testing
  • PCB Circuit Board, Assemble the Boards, SMT/BGA/DIP and Functional Testing
  • PCB Circuit Board, Assemble the Boards, SMT/BGA/DIP and Functional Testing
  • PCB Circuit Board, Assemble the Boards, SMT/BGA/DIP and Functional Testing
PCB Circuit Board, Assemble the Boards, SMT/BGA/DIP and Functional Testing
PCB Circuit Board, Assemble the Boards, SMT/BGA/DIP and Functional Testing
PCB Circuit Board, Assemble the Boards, SMT/BGA/DIP and Functional Testing
PCB Circuit Board, Assemble the Boards, SMT/BGA/DIP and Functional Testing
PCB Circuit Board, Assemble the Boards, SMT/BGA/DIP and Functional Testing
PCB Circuit Board, Assemble the Boards, SMT/BGA/DIP and Functional Testing

PCB Circuit Board, Assemble the Boards, SMT/BGA/DIP and Functional Testing

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T/T
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Basic Info
Basic Info
Payment Type: T/T
Product Description
Product Description
  • Specifications:
    • Layer count: 2-28
    • Board materials: FR-4, CEM-3, high-TG, aluminum base, Ro4002.Ro4003F4 and BT
    • Maximum size: 400 x 500mm
    • Copper foil outer/inner layer: 1/2-2/1/2-2/3oz
    • Drill hole bit (mechanical hole): 0.2-6.00mm
    • Laser hole size: 0.1mm 
    • Line margin: 0.2mm
    • CNC: 0.30mm
    • Punch: 0.50mm (V-cut)
    • Colors: green, yellow, black, matt, blue, red ink and peelable blue glue
    • Dam (minimum): 2.5mil
    • Opening (minimum): 2.5mil
    • Plug hole size: 0.25-0.7mm
    • Routing tolerance: ±3%mil
    • Punching tolerance: ±4%mil
    • V-CUT angle: 30, 45 and  60 degrees
    • V-CUT deepness tolerance: ±0.15
    • V-CUT: ±0.1mm (CNC V-CUT)
    • Surface finish: Lead free HAL, oaranic solderability preservative, electroless nickel/immersion gold, immersion tin, immersion silver, gold plated and selective treatment
    • Can offer one stop services, including, design, sourcing and EMS
    • Design: PCB 
    • Hardware
    • Software
    • Industrial structure
  • Sourcing:
    • Component
    • Wire stock
  • Material: plastic
  • EMS:
    • Prototyping
    • Programming
    • ICT test
    • Function: test
    • Box-build
  • Primary competitive advantages:
    • Brand-name parts
    • Green product
    • Packing
    • Quality approvals
    • Small orders accepted 
  • Main export markets:
    • Asia
    • Australasia
    • Central/South America
    • Eastern Europe
    • Mid East/Africa
    • North America
    • Western Europe
  • Layer count: 2-28
  • Board materials: FR-4, CEM-3, high-TG, aluminum base, Ro4002.Ro4003F4 and BT
  • Maximum size: 400 x 500mm
  • Copper foil outer/inner layer: 1/2-2/1/2-2/3oz
  • Drill hole bit (mechanical hole): 0.2-6.00mm
  • Laser hole size: 0.1mm 
  • Line margin: 0.2mm
  • CNC: 0.30mm
  • Punch: 0.50mm (V-cut)
  • Colors: green, yellow, black, matt, blue, red ink and peelable blue glue
  • Dam (minimum): 2.5mil
  • Opening (minimum): 2.5mil
  • Plug hole size: 0.25-0.7mm
  • Routing tolerance: ±3%mil
  • Punching tolerance: ±4%mil
  • V-CUT angle: 30, 45 and  60 degrees
  • V-CUT deepness tolerance: ±0.15
  • V-CUT: ±0.1mm (CNC V-CUT)
  • Surface finish: Lead free HAL, oaranic solderability preservative, electroless nickel/immersion gold, immersion tin, immersion silver, gold plated and selective treatment
  • Can offer one stop services, including, design, sourcing and EMS
  • Design: PCB 
  • Hardware
  • Software
  • Industrial structure
  • Component
  • Wire stock
  • Prototyping
  • Programming
  • ICT test
  • Function: test
  • Box-build
  • Brand-name parts
  • Green product
  • Packing
  • Quality approvals
  • Small orders accepted 
  • Asia
  • Australasia
  • Central/South America
  • Eastern Europe
  • Mid East/Africa
  • North America
  • Western Europe
  • Send your message to this supplier

    • Ms.  Summer Marketing

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