Succeedin Summer Corp. Ltd
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Succeedin Summer Corp. Ltd
PCB Assembly with SMD Processing, Compliant with UL, CE and RoHS for Wi-Fi Module
  • PCB Assembly with SMD Processing, Compliant with UL, CE and RoHS for Wi-Fi Module
  • PCB Assembly with SMD Processing, Compliant with UL, CE and RoHS for Wi-Fi Module
  • PCB Assembly with SMD Processing, Compliant with UL, CE and RoHS for Wi-Fi Module
  • PCB Assembly with SMD Processing, Compliant with UL, CE and RoHS for Wi-Fi Module
  • PCB Assembly with SMD Processing, Compliant with UL, CE and RoHS for Wi-Fi Module
  • PCB Assembly with SMD Processing, Compliant with UL, CE and RoHS for Wi-Fi Module
PCB Assembly with SMD Processing, Compliant with UL, CE and RoHS for Wi-Fi Module
PCB Assembly with SMD Processing, Compliant with UL, CE and RoHS for Wi-Fi Module
PCB Assembly with SMD Processing, Compliant with UL, CE and RoHS for Wi-Fi Module
PCB Assembly with SMD Processing, Compliant with UL, CE and RoHS for Wi-Fi Module
PCB Assembly with SMD Processing, Compliant with UL, CE and RoHS for Wi-Fi Module
PCB Assembly with SMD Processing, Compliant with UL, CE and RoHS for Wi-Fi Module

PCB Assembly with SMD Processing, Compliant with UL, CE and RoHS for Wi-Fi Module

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Basic Info
Basic Info
Payment Type: T/T
Product Description
Product Description
  • Specifications:
    • Layer count: 2-28
    • Board material: FR-4, CEM-3, high-TG, aluminum base, Ro4002.Ro4003F4, BT
    • Maximum size: 400 x 500mm
    • Copper foil outer/inner layer: 1/2-2oz/1/2oz-2/3oz
    • Drill hole bit (mechanical hole): 0.2-6.00mm
    • Laser hole size :0.1mm
    • Line margin: 0.2mm (CNC), 0.30mm (punch), 0.50mm (V-cut)
    • Colors: green, yellow, black, matte, blue, red ink, and peelable blue glue
    • Dam (min): 2.5mil
    • Opening (min): 2.5mil
    • Plug hole size: 0.25-0.7mm
    • Routing tolerance: ±3% mil
    • Punching tolerance: ±4%mil
    • V-cut angle: 30, 45 and 60°
    • V-cut deepness tolerance: ±0.15 (V-cut), ±0.1mm (CNC V-cut)
    • Surface finish: lead-free HAL, organic solderability preservative, electroless nickel/immersion gold, immersion tin, immersion silver, gold plated, selective treatment
    • We can offer one stop services, including, design, sourcing and EMS
  • Design:
    • PCB design
    • Hardware
    • Software
    • Industrial structure
    • Sourcing:
      • Component
      • Wire stock
      • Material: plastic
  • EMS:
    • Prototyping
    • Programming
    • ICT test
    • Function: test
    • Box-build
  • Layer count: 2-28
  • Board material: FR-4, CEM-3, high-TG, aluminum base, Ro4002.Ro4003F4, BT
  • Maximum size: 400 x 500mm
  • Copper foil outer/inner layer: 1/2-2oz/1/2oz-2/3oz
  • Drill hole bit (mechanical hole): 0.2-6.00mm
  • Laser hole size :0.1mm
  • Line margin: 0.2mm (CNC), 0.30mm (punch), 0.50mm (V-cut)
  • Colors: green, yellow, black, matte, blue, red ink, and peelable blue glue
  • Dam (min): 2.5mil
  • Opening (min): 2.5mil
  • Plug hole size: 0.25-0.7mm
  • Routing tolerance: ±3% mil
  • Punching tolerance: ±4%mil
  • V-cut angle: 30, 45 and 60°
  • V-cut deepness tolerance: ±0.15 (V-cut), ±0.1mm (CNC V-cut)
  • Surface finish: lead-free HAL, organic solderability preservative, electroless nickel/immersion gold, immersion tin, immersion silver, gold plated, selective treatment
  • We can offer one stop services, including, design, sourcing and EMS
  • PCB design
  • Hardware
  • Software
  • Industrial structure
  • Sourcing:
    • Component
    • Wire stock
    • Material: plastic
  • Component
  • Wire stock
  • Material: plastic
  • Prototyping
  • Programming
  • ICT test
  • Function: test
  • Box-build

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    • Enter between 20 to 4,000 characters.

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