
PCB Assembly for Industrial, with SMD + DIP Assembly Process
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Basic Info
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Product Description
Product Description
- Layer count: 2 to 28
- Board materials: FR-4, CEM-3, high-TG, aluminum base, Ro4002.Ro4003F4 and BT
- Maximum size: 400 x 500mm
- Copper foil outer/inner layer: 1/2 to 2/3oz
- Drill hole bit (mechanical hole): 0.2 to 6.00mm
- Laser hole size: 0.1mm
- Line margin: 0.2mm (CNC), 0.30mm (punch) and 0.50mm (V-cut)
- Colors: green, yellow, black, matte, blue, red ink and peelable blue glue
- Dam (minimum): 2.5mil
- Opening (minimum): 2.5mil
- Plug hole size: 0.25 o 0.7mm
- Routing tolerance: ±3%mil
- Punching tolerance: ±4%mil
- V-cut angle: 30, 45 and 60°
- V-cut deepness tolerance: ±0.15 (V-cut) and ±0.1mm (CNC V-cut)
- Surface finish: lead-free HAL, organic solderability preservative, electroless nickel/immersion gold, immersion tin, immersion silver, gold plated and selective treatment
- PCB design
- Hardware
- Software
- Industrial structure
- Component
- Wire stock
- Material: plastic
- Prototyping
- Programming
- ICT test
- Function test
- Box-build
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