Succeedin Summer Corp. Ltd
Succeedin Summer Corp. Ltd
PCB Assembly for Industrial, with SMD + DIP Assembly Process
  • PCB Assembly for Industrial, with SMD + DIP Assembly Process
  • PCB Assembly for Industrial, with SMD + DIP Assembly Process
  • PCB Assembly for Industrial, with SMD + DIP Assembly Process
  • PCB Assembly for Industrial, with SMD + DIP Assembly Process
  • PCB Assembly for Industrial, with SMD + DIP Assembly Process
  • PCB Assembly for Industrial, with SMD + DIP Assembly Process
PCB Assembly for Industrial, with SMD + DIP Assembly Process
PCB Assembly for Industrial, with SMD + DIP Assembly Process
PCB Assembly for Industrial, with SMD + DIP Assembly Process
PCB Assembly for Industrial, with SMD + DIP Assembly Process
PCB Assembly for Industrial, with SMD + DIP Assembly Process
PCB Assembly for Industrial, with SMD + DIP Assembly Process

PCB Assembly for Industrial, with SMD + DIP Assembly Process

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T/T
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Basic Info
Basic Info
Payment Type: T/T
Product Description
Product Description
  • Specifications:
    • Layer count: 2 to 28
    • Board materials: FR-4, CEM-3, high-TG, aluminum base, Ro4002.Ro4003F4 and BT
    • Maximum size: 400 x 500mm
    • Copper foil outer/inner layer: 1/2 to 2/3oz
    • Drill hole bit (mechanical hole): 0.2 to 6.00mm
    • Laser hole size: 0.1mm
    • Line margin: 0.2mm (CNC), 0.30mm (punch) and 0.50mm (V-cut)
    • Colors: green, yellow, black, matte, blue, red ink and peelable blue glue
    • Dam (minimum): 2.5mil
    • Opening (minimum): 2.5mil
    • Plug hole size: 0.25 o 0.7mm
    • Routing tolerance: ±3%mil
    • Punching tolerance: ±4%mil
    • V-cut angle: 30, 45 and 60°
    • V-cut deepness tolerance: ±0.15 (V-cut) and ±0.1mm (CNC V-cut)
    • Surface finish: lead-free HAL, organic solderability preservative, electroless nickel/immersion gold, immersion tin, immersion silver, gold plated and selective treatment
  • We can offer one stop services, including, design, sourcing and EMS
  • Design:
    • PCB design
    • Hardware
    • Software
    • Industrial structure
  • Sourcing:
    • Component
    • Wire stock
    • Material: plastic
  • EMS:
    • Prototyping
    • Programming
    • ICT test
    • Function test
    • Box-build
  • Layer count: 2 to 28
  • Board materials: FR-4, CEM-3, high-TG, aluminum base, Ro4002.Ro4003F4 and BT
  • Maximum size: 400 x 500mm
  • Copper foil outer/inner layer: 1/2 to 2/3oz
  • Drill hole bit (mechanical hole): 0.2 to 6.00mm
  • Laser hole size: 0.1mm
  • Line margin: 0.2mm (CNC), 0.30mm (punch) and 0.50mm (V-cut)
  • Colors: green, yellow, black, matte, blue, red ink and peelable blue glue
  • Dam (minimum): 2.5mil
  • Opening (minimum): 2.5mil
  • Plug hole size: 0.25 o 0.7mm
  • Routing tolerance: ±3%mil
  • Punching tolerance: ±4%mil
  • V-cut angle: 30, 45 and 60°
  • V-cut deepness tolerance: ±0.15 (V-cut) and ±0.1mm (CNC V-cut)
  • Surface finish: lead-free HAL, organic solderability preservative, electroless nickel/immersion gold, immersion tin, immersion silver, gold plated and selective treatment
  • PCB design
  • Hardware
  • Software
  • Industrial structure
  • Component
  • Wire stock
  • Material: plastic
  • Prototyping
  • Programming
  • ICT test
  • Function test
  • Box-build
  • Send your message to this supplier

    • Ms.  Summer Marketing

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