Succeedin Summer Corp. Ltd
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Products
Succeedin Summer Corp. Ltd
PCB Assembly with 0.2mm IC Pitch, Complies with IPC-A-160 Soldering Standard
  • PCB Assembly with 0.2mm IC Pitch, Complies with IPC-A-160 Soldering Standard
PCB Assembly with 0.2mm IC Pitch, Complies with IPC-A-160 Soldering Standard

PCB Assembly with 0.2mm IC Pitch, Complies with IPC-A-160 Soldering Standard

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Basic Info
Basic Info
Payment Type: 100% T/T in Advance
Product Description
Product Description
  • Re-layouts
  • Bare PCB/FPC fabrication
  • Components procurement
  • Assemble boards, SMT, BGA and DIP
  • Mechanical and functional testing
  • Inspection of finished products
  • Wire harnesses and cable assembly
  • Case, housing and rubber molding assembly
  • Complies with IPC-A-160 soldering standard
  • IC pitch: 0.2mm (8mil)
  • BGA/CSP pitch: 0.2mm
  • Board complexity:
    • SMT, PTH and box build
    • Single/double side reflow
  • Glue: supported
  • Nitrogen reflow/wave: supported
  • Process: clean/no and clean/lead-free
  • Baking oven: supported
  • BGA inspection/rework: supported
  • SMT, PTH and box build
  • Single/double side reflow

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