Flexible and Polyimide PCBs with Solder, Nickel, Gold Plating

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Basic Info

Payment Type:	Telegraphic Transfer (TT,T/T)

Product Description

Number of layers: 1 to 4 (flexible)

Base material thickness: 25, 50, 75, 100um), 1/2, 1, 2, 3-mil

Copper conductor thickness: 18, 35, 70um, 1/2, 1, 2oz

Materials: polyester, polyimide

Copper: RA, ED

Minimum hole diameter: O 0.2mm

Minimum line/space width: 0.1mm

Minimum annular ring: 0.1mm

Maximum panel size: 500 x 500mm

Plating: solder, nickel, gold

Volume resistivity: 1 x 1,015 (IPC-TM-650 2.5.6.17)

Dissipation factor (1MHz): 0.04 (mil-P55617)

Solder heat-resistance: 300°C/10 seconds

Dielectric strength: 5kV (IPC-TM-650 2.5.6.1)

Insulation resistance: 1,000mW (IPC-TM-650: 2, 6, 3, 2 at ambient)

Peeling strength (180° direction): 1.0kg/cm (IPC-TM-650 2.4.9)

Flammability: 94 V-0 (UL94)

Surface resistance: 5 x 1,012 (IPC-TM-650 2.5.6.17)

Dissipation factor (1MHz): 0.04 (mil-P-55617)

With RoHS Directive-compliant

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