Shenzhen Seyi Electronic Technology Co. Ltd
Shenzhen Seyi Electronic Technology Co. Ltd
Flexible PCB, 500 x 500mm Maximum Panel Size with RoHS Directive-compliant
  • Flexible PCB, 500 x 500mm Maximum Panel Size with RoHS Directive-compliant
Flexible PCB, 500 x 500mm Maximum Panel Size with RoHS Directive-compliant

Flexible PCB, 500 x 500mm Maximum Panel Size with RoHS Directive-compliant

Payment Type:
Telegraphic Transfer (TT, T/T)
Quantity:

Your message must be between 20 to 2000 characters

Contact Now
Basic Info
Basic Info
Payment Type: Telegraphic Transfer (TT,T/T)
Product Description
Product Description
  • Specifications:
    • Number of layers: 1 to 2  (flexible)
    • Base material thickness: 25, 50, 75, 100um), 1/2, 1, 2, 3-mil
    • Copper conductor thickness: 18, 35, 70um, 1/2, 1, 2oz
    • Materials: polyester, polyimide
    • Copper: RA, ED
    • Minimum hole diameter: O 0.2mm
    • Minimum line/space width: 0.1mm
    • Minimum annular ring: 0.1mm
    • Maximum panel size: 500 x 500mm
    • Plating: solder, nickel, gold
    • Volume resistivity: 1 x 1,015 (IPC-TM-650 2.5.6.17)
    • Dissipation factor (1MHz): 0.04 (mil-P55617)
    • Solder heat-resistance: 300°C/10 seconds
    • Dielectric strength: 5kV (IPC-TM-650 2.5.6.1)
    • Insulation resistance: 1,000mW (IPC-TM-650: 2, 6, 3, 2 at ambient)
    • Peeling strength (180-degree direction): 1.0kg/cm (IPC-TM-650 2.4.9)
    • Flammability: 94 V-0 (UL94)
    • Surface resistance: 5 x 1,012 (IPC-TM-650 2.5.6.17)
    • Dissipation factor (1MHz): 0.04 (mil-P-55617)
    • With RoHS Directive-compliant
  • Number of layers: 1 to 2  (flexible)
  • Base material thickness: 25, 50, 75, 100um), 1/2, 1, 2, 3-mil
  • Copper conductor thickness: 18, 35, 70um, 1/2, 1, 2oz
  • Materials: polyester, polyimide
  • Copper: RA, ED
  • Minimum hole diameter: O 0.2mm
  • Minimum line/space width: 0.1mm
  • Minimum annular ring: 0.1mm
  • Maximum panel size: 500 x 500mm
  • Plating: solder, nickel, gold
  • Volume resistivity: 1 x 1,015 (IPC-TM-650 2.5.6.17)
  • Dissipation factor (1MHz): 0.04 (mil-P55617)
  • Solder heat-resistance: 300°C/10 seconds
  • Dielectric strength: 5kV (IPC-TM-650 2.5.6.1)
  • Insulation resistance: 1,000mW (IPC-TM-650: 2, 6, 3, 2 at ambient)
  • Peeling strength (180-degree direction): 1.0kg/cm (IPC-TM-650 2.4.9)
  • Flammability: 94 V-0 (UL94)
  • Surface resistance: 5 x 1,012 (IPC-TM-650 2.5.6.17)
  • Dissipation factor (1MHz): 0.04 (mil-P-55617)
  • With RoHS Directive-compliant
  • Send your message to this supplier

    • Ms.  Cissy

    • Enter between 20 to 4,000 characters.

    Related Keywords

    Related Keywords