Shenzhen Seyi Electronic Technology Co. Ltd
Shenzhen Seyi Electronic Technology Co. Ltd
BGA Flexible PCB, Made of Polyester, Polyimide Materials with 0.2mm Minimum Hole Diameter
  • BGA Flexible PCB, Made of Polyester, Polyimide Materials with 0.2mm Minimum Hole Diameter
BGA Flexible PCB, Made of Polyester, Polyimide Materials with 0.2mm Minimum Hole Diameter

BGA Flexible PCB, Made of Polyester, Polyimide Materials with 0.2mm Minimum Hole Diameter

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Basic Info
Basic Info
Payment Type: Telegraphic Transfer (TT,T/T)
Product Description
Product Description
  • Specifications:
    • Number of layers: 1 to 6 (flexible)
    • Base material thickness: 25, 50, 75, 100um), 1/2, 1, 2, 3-mil
    • Copper conductor thickness: 18, 35, 70um, 1/2, 1, 2oz
    • Materials: polyester, polyimide
    • Copper: RA, ED
    • Minimum hole diameter: 0.2mm
    • Minimum line/space width: 0.1mm
    • Minimum annular ring: 0.1mm
    • Maximum panel size: 500x 500mm
    • Plating: solder, nickel, gold
    • Volume resistivity: 1 x 1,015 (IPC-TM-650 2.5.6.17)
    • Dissipation factor (1MHz): 0.04 (mil-P55617)
    • Solder heat resistance: 300°C/10 seconds
    • Dielectric strength: 5kV (IPC-TM-650 2.5.6.1)
    • Insulation resistance: 1,000mW (IPC-TM-650: 2, 6, 3, 2 at ambient)
    • Peeling strength (180° direction): 1.0kg/cm (IPC-TM-650 2.4.9)
    • Flammability: 94 V-0 (UL94)
    • Surface resistance: 5 x 1,012 (IPC-TM-650 2.5.6.17)
    • Dissipation factor (1MHz): 0.04 (mil-P-55617)
    • With RoHS Directive-compliant
  • Number of layers: 1 to 6 (flexible)
  • Base material thickness: 25, 50, 75, 100um), 1/2, 1, 2, 3-mil
  • Copper conductor thickness: 18, 35, 70um, 1/2, 1, 2oz
  • Materials: polyester, polyimide
  • Copper: RA, ED
  • Minimum hole diameter: 0.2mm
  • Minimum line/space width: 0.1mm
  • Minimum annular ring: 0.1mm
  • Maximum panel size: 500x 500mm
  • Plating: solder, nickel, gold
  • Volume resistivity: 1 x 1,015 (IPC-TM-650 2.5.6.17)
  • Dissipation factor (1MHz): 0.04 (mil-P55617)
  • Solder heat resistance: 300°C/10 seconds
  • Dielectric strength: 5kV (IPC-TM-650 2.5.6.1)
  • Insulation resistance: 1,000mW (IPC-TM-650: 2, 6, 3, 2 at ambient)
  • Peeling strength (180° direction): 1.0kg/cm (IPC-TM-650 2.4.9)
  • Flammability: 94 V-0 (UL94)
  • Surface resistance: 5 x 1,012 (IPC-TM-650 2.5.6.17)
  • Dissipation factor (1MHz): 0.04 (mil-P-55617)
  • With RoHS Directive-compliant
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