Shenzhen Jiu An Electronics Technology Co. Ltd
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Products
Shenzhen Jiu An Electronics Technology Co. Ltd
Competitive Price, PCBA/PCB Assembly with High Standard SMT /DIP
  • Competitive Price, PCBA/PCB Assembly with High Standard SMT /DIP
Competitive Price, PCBA/PCB Assembly with High Standard SMT /DIP

Competitive Price, PCBA/PCB Assembly with High Standard SMT /DIP

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Basic Info
Basic Info
Payment Type: T/T in Advance, L/C at Sight, PayPal, Western Unio
Product Description
Product Description
  • Features:
    • Board thickness: 1.6mm
    • Copper thickness: 1oz
    • HASL-LF surface finishing
    • Green solder mask and white legend
    • With UL and RoHS marks
    • Fast prototype and mass production for PCB assembly as per buyers' requirement
    • Component sourcing, PCB reverse engineering and PIC decoding are available
  • PCB capability:
    • Maximum layers count for rigid PCB: 1-12
    • PCB board thickness: 14-175 mils
    • Drill to metal: 7 mils
    • Hole size: 6 mils
    • Inner layer registration: 3 mils
    • Line width and space inner/outer: 3/3 mils (minimum)
    • Aspect ratio:
      • Minimum solder mask dam: 2.5 mils
    • Controlled impedance: ±8%
    • Maximum internal copper weight: 3oz
    • Advanced technology: blind/buried via, HDI micro via
    • Surface treatment: ENIG, OSP, immersion silver/tin, lead-free HASL
    • Materials: FR4, high Tg epoxy, halogen-free
    • Lead-time: 5-20 days (depends on QTY, production status and more)
  • Applications:
    • Computers, communications, test and control systems, medical equipment and more
  • Board thickness: 1.6mm
  • Copper thickness: 1oz
  • HASL-LF surface finishing
  • Green solder mask and white legend
  • With UL and RoHS marks
  • Fast prototype and mass production for PCB assembly as per buyers' requirement
  • Component sourcing, PCB reverse engineering and PIC decoding are available
  • Maximum layers count for rigid PCB: 1-12
  • PCB board thickness: 14-175 mils
  • Drill to metal: 7 mils
  • Hole size: 6 mils
  • Inner layer registration: 3 mils
  • Line width and space inner/outer: 3/3 mils (minimum)
  • Aspect ratio:
    • Minimum solder mask dam: 2.5 mils
  • Controlled impedance: ±8%
  • Maximum internal copper weight: 3oz
  • Advanced technology: blind/buried via, HDI micro via
  • Surface treatment: ENIG, OSP, immersion silver/tin, lead-free HASL
  • Materials: FR4, high Tg epoxy, halogen-free
  • Lead-time: 5-20 days (depends on QTY, production status and more)
  • Minimum solder mask dam: 2.5 mils
  • Computers, communications, test and control systems, medical equipment and more

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