PCB Prototype and Mass Assembly Services, Rigid PCB Assembly

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Basic Info

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Product Description

Specifications:

Board thickness: 0.8 to 3.0mm
Copper thickness: 1.5oz
Special techniques: blind and buried via + impedance control
Materials: rigid PCB (FR4, CEM-3, aluminum, metal core PCB)
Surface treatment: HASL/HASL lead-free, chemical tin, chemical gold, immersion: silver/gold, OSP, gold plating
0.1mm on integrated circuit parts with SO, SOP, SOJ, TSSOP, QFP and BGA
SMT: 0201, 0402, 0603, 0805, 1008, 1206 and 1210
DIP pitch through hole down to 0.60mm
Solder components to underside of board without disrupting topside
Inspection online for AOI and ICT test
X-ray inspection for BGA
High-precision e-testing includes ICT inline, function test, full experienced QC and QA engineer