Shenzhen Jiu An Electronics Technology Co. Ltd
Shenzhen Jiu An Electronics Technology Co. Ltd
PCB Assembly, OEM/ODM Services are Provided
  • PCB Assembly, OEM/ODM Services are Provided
PCB Assembly, OEM/ODM Services are Provided

PCB Assembly, OEM/ODM Services are Provided

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T/T, L/C, PayPal
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Basic Info
Basic Info
Payment Type: T/T, L/C, PayPal
Product Description
Product Description
  • Features:
    • FR-4 board
    • 1.6mm board thickness
    • 1oz copper thickness
    • HASL-LF surface finishing, green solder mask and white legend
    • With UL and RoHS marks
    • Fast prototype and mass production for PCB assembly as per buyers' requirement
    • Component sourcing, PCB reverse engineering and PIC decoding available
    • High-quality and good price
  • PCB capability:
    • Maximum layers count for rigid PCB: 12
    • PCB board thickness: 14-175-mil
    • Drill to metal: 7 mils
    • Hole size: 6 mils
    • Inner layer registration: 3 mils
    • Line width and space inner/outer: 3/3-mil (minimum)
    • Aspect ratio: 10:1
    • Minimum solder mask dam: 2.5 mils
    • Controlled impedance: ±8%
    • Maximum internal copper weight: 3oz
    • Advanced technology: blind/buried via, HDI micro via
    • Surface treatment: ENIG, OSP, immersion silver/tin, lead-free HASL
    • Materials: FR4, high-TG Epoxy, halogen-free
    • Certificates: RoHS and UL
  • Application: computers, communication, test and control systems, medical equipment and more
  • Lead-time: 5-20 days (depending on qty, production status and more)
  • FR-4 board
  • 1.6mm board thickness
  • 1oz copper thickness
  • HASL-LF surface finishing, green solder mask and white legend
  • With UL and RoHS marks
  • Fast prototype and mass production for PCB assembly as per buyers' requirement
  • Component sourcing, PCB reverse engineering and PIC decoding available
  • High-quality and good price
  • Maximum layers count for rigid PCB: 12
  • PCB board thickness: 14-175-mil
  • Drill to metal: 7 mils
  • Hole size: 6 mils
  • Inner layer registration: 3 mils
  • Line width and space inner/outer: 3/3-mil (minimum)
  • Aspect ratio: 10:1
  • Minimum solder mask dam: 2.5 mils
  • Controlled impedance: ±8%
  • Maximum internal copper weight: 3oz
  • Advanced technology: blind/buried via, HDI micro via
  • Surface treatment: ENIG, OSP, immersion silver/tin, lead-free HASL
  • Materials: FR4, high-TG Epoxy, halogen-free
  • Certificates: RoHS and UL
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