Shenzhen Jiu An Electronics Technology Co. Ltd
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Products
Shenzhen Jiu An Electronics Technology Co. Ltd
One stop PCB assembly service,
  • One stop PCB assembly service,
One stop PCB assembly service,

One stop PCB assembly service,

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T/T in Advance, L/C at Sight, PayPal, Western Unio
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Basic Info
Basic Info
Payment Type: T/T in Advance, L/C at Sight, PayPal, Western Unio
Product Description
Product Description
  • Features:
    • FR-4 board
    • 1.6mm board thickness
    • 1oz copper thickness
    • HASL-LF surface finishing, green solder mask and white legend
    • With UL and RoHS marks
    • Fast prototype and mass production for PCB assembly as per buyers' requirement
    • Component sourcing, PCB reverse engineering and PIC decoding available
    • High-quality and good price
  • PCB capability:
    • Maximum layers count for rigid PCB: 12
    • PCB board thicknesses: 14-175-mil
    • Drill to metal: 7 mils
    • Hole size: 6 mils
    • Inner layer registration: 3 mils
    • Aspect ratio: 10:1
    • Line width and space inner/outer: 3/3-mil (minimum)
    • Aspect ratio: minimum solder mask dam: 2.5 mils
    • Controlled impedance: ±8%
    • Maximum internal copper weight: 3oz
    • Advanced technology: blind/buried via, HDI micro via
    • Surface treatment: ENIG, OSP, immersion silver/tin, lead-free HASL
    • Materials: FR4, high-TG Epoxy, halogen-free
    • Certificates: RoHS and UL
    • Application: computers, communication, test and control systems, medical equipment and more
    • Lead-time: 5-20 days (depends on QTY, production status and more)
  • FR-4 board
  • 1.6mm board thickness
  • 1oz copper thickness
  • HASL-LF surface finishing, green solder mask and white legend
  • With UL and RoHS marks
  • Fast prototype and mass production for PCB assembly as per buyers' requirement
  • Component sourcing, PCB reverse engineering and PIC decoding available
  • High-quality and good price
  • Maximum layers count for rigid PCB: 12
  • PCB board thicknesses: 14-175-mil
  • Drill to metal: 7 mils
  • Hole size: 6 mils
  • Inner layer registration: 3 mils
  • Aspect ratio: 10:1
  • Line width and space inner/outer: 3/3-mil (minimum)
  • Aspect ratio: minimum solder mask dam: 2.5 mils
  • Controlled impedance: ±8%
  • Maximum internal copper weight: 3oz
  • Advanced technology: blind/buried via, HDI micro via
  • Surface treatment: ENIG, OSP, immersion silver/tin, lead-free HASL
  • Materials: FR4, high-TG Epoxy, halogen-free
  • Certificates: RoHS and UL
  • Application: computers, communication, test and control systems, medical equipment and more
  • Lead-time: 5-20 days (depends on QTY, production status and more)

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