Shenzhen Ledor Optoelectronics Co. Ltd
Shenzhen Ledor Optoelectronics Co. Ltd
LD 10W ODM Round LED Grow Light for LED Bulb with 3535 Chip in Special Spectrum
  • LD 10W ODM Round LED Grow Light for LED Bulb with 3535 Chip in Special Spectrum
  • LD 10W ODM Round LED Grow Light for LED Bulb with 3535 Chip in Special Spectrum
  • LD 10W ODM Round LED Grow Light for LED Bulb with 3535 Chip in Special Spectrum
  • LD 10W ODM Round LED Grow Light for LED Bulb with 3535 Chip in Special Spectrum
  • LD 10W ODM Round LED Grow Light for LED Bulb with 3535 Chip in Special Spectrum
  • LD 10W ODM Round LED Grow Light for LED Bulb with 3535 Chip in Special Spectrum
  • LD 10W ODM Round LED Grow Light for LED Bulb with 3535 Chip in Special Spectrum
  • LD 10W ODM Round LED Grow Light for LED Bulb with 3535 Chip in Special Spectrum
LD 10W ODM Round LED Grow Light for LED Bulb with 3535 Chip in Special Spectrum
LD 10W ODM Round LED Grow Light for LED Bulb with 3535 Chip in Special Spectrum
LD 10W ODM Round LED Grow Light for LED Bulb with 3535 Chip in Special Spectrum
LD 10W ODM Round LED Grow Light for LED Bulb with 3535 Chip in Special Spectrum
LD 10W ODM Round LED Grow Light for LED Bulb with 3535 Chip in Special Spectrum
LD 10W ODM Round LED Grow Light for LED Bulb with 3535 Chip in Special Spectrum
LD 10W ODM Round LED Grow Light for LED Bulb with 3535 Chip in Special Spectrum
LD 10W ODM Round LED Grow Light for LED Bulb with 3535 Chip in Special Spectrum

LD 10W ODM Round LED Grow Light for LED Bulb with 3535 Chip in Special Spectrum

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Basic Info
Basic Info
Payment Type: T/T, Cash
Product Description
Product Description
  • Specifications:
    • Layers: 1 to 2
    • Thickness: 0.6-3.0mm
    • Thermal conductivity: 1.0-3.0C/W
    • Materials: FR-4, aluminum
    • Surface finishing: HASL, immersion gold, immersion silver and OSP
    • Solder mask types: white, black
    • Finishing board thickness: 0.2 to 3.2mm
    • Certifications: UL, RoHS
    • Copper thickness: 35 to 70um
    • Copper plating hole: 18 to 40um
    • Trace width and line spacing: 0.1mm
    • Maximum panel dimensions: 610 x 1,200mm
    • Hole position tolerance: 0.075mm
    • Hole dimension tolerance: 0.05mm
    • Outline tolerance: 0.1mm
    • Warp and twist: ≤0.70%
    • Minimum solder mask bridge: 0.0635mm
    • Minimum distance between line to board bridge: 0.1mm
    • Impedance control tolerance: ±5%
    • Test voltage: 10 to 300V
  • Layers: 1 to 2
  • Thickness: 0.6-3.0mm
  • Thermal conductivity: 1.0-3.0C/W
  • Materials: FR-4, aluminum
  • Surface finishing: HASL, immersion gold, immersion silver and OSP
  • Solder mask types: white, black
  • Finishing board thickness: 0.2 to 3.2mm
  • Certifications: UL, RoHS
  • Copper thickness: 35 to 70um
  • Copper plating hole: 18 to 40um
  • Trace width and line spacing: 0.1mm
  • Maximum panel dimensions: 610 x 1,200mm
  • Hole position tolerance: 0.075mm
  • Hole dimension tolerance: 0.05mm
  • Outline tolerance: 0.1mm
  • Warp and twist: ≤0.70%
  • Minimum solder mask bridge: 0.0635mm
  • Minimum distance between line to board bridge: 0.1mm
  • Impedance control tolerance: ±5%
  • Test voltage: 10 to 300V
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    • Enter between 20 to 4,000 characters.

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