Comcome Limited
Comcome Limited
One-stop OEM service Turkey PCB service, Cable and harness Assembly, Surface-mount Assembly
  • One-stop OEM service Turkey PCB service, Cable and harness Assembly, Surface-mount Assembly
  • One-stop OEM service Turkey PCB service, Cable and harness Assembly, Surface-mount Assembly
  • One-stop OEM service Turkey PCB service, Cable and harness Assembly, Surface-mount Assembly
  • One-stop OEM service Turkey PCB service, Cable and harness Assembly, Surface-mount Assembly
One-stop OEM service Turkey PCB service, Cable and harness Assembly, Surface-mount Assembly
One-stop OEM service Turkey PCB service, Cable and harness Assembly, Surface-mount Assembly
One-stop OEM service Turkey PCB service, Cable and harness Assembly, Surface-mount Assembly
One-stop OEM service Turkey PCB service, Cable and harness Assembly, Surface-mount Assembly

One-stop OEM service Turkey PCB service, Cable and harness Assembly, Surface-mount Assembly

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Basic Info
Basic Info
Payment Type: T/T or L/C at Sight or PayPal
Product Description
Product Description
  • PCB Process capability
  • Item Parameters
    • Rigid board Flex-(Rigid) board
    • Layers: 1-40 layers 0-10/11-14 layers
    • Max.working panel: 508x610(mm) 457x610 or 254x737(mm)
    • Min. line width/spacing 3/3 mil for 0.5oz base copper 3/3 mil for 0.5oz base copper
    • Min. hole size: 0.1mm for laser drill 0.20mm
    • Copper thickness: 12-280um 12-105um
    • Finished board thickness: 0.2-8.0mm 0.071-1.8mm
    • Drill to copper: 7mil(min) /
    • Aspect ratio: 20:01 10:01
    • Impedance control: 5% 10%
    • High voltage test: 4000v /
    • Base materials: CEM1,CEM3,FR1,FR2,
    • FR4,Halogen free FR4,High TG FR-4,Rogers,Getek, Arlon, Nelco,Rcc,Hy-bird, PTFE,etc. PI
    • Normal Surface finish HASL, Lead Free HASL, HASL, Lead Free HASL,
    • ENIG, Imm.Sn, Imm.Ag, ENIG, Imm.Sn, Imm.Ag,
    • OSP, Flash Gold, Hard Gold plated, Gold Finger OSP, Flash Gold, Hard Gold plated, Gold Finger, Silver Slurry
    • Selective surface HASL/LF HASL+Gold Finger, HASL/LF HASL+Gold Finger
    • finish HASL/LF HASL+ENIG, HASL/LF HASL+ENIG
    • ENIG/IMM.Sn/IMM.Ag+G/F ENIG/IMM.Sn/IMM.Ag+G/F
    • ENIG+OSP ENIG+OSP
    • OSP+G/F Silver Slurry+Gold plated
    • Silver Slurry+ENIG
    • Normal IPC-A-600G class 2 IPC-A-600G class 2
    • Advance IPC-A-600G class 3 IPC-A-600G class 3
    • Item Rigid board
    • Normal Advance
    • Inner layer registration: ±3mil
    • Min. solder maks dam: 3mil 2.5mil
    • Tolerance of line width/spacing: ±20% ±10%
    • Tolerance of FBT: ±10% ±8%
    • Min. QFP spacing: 20mil 16mil(not HASL)
    • Tolerance of PTH: ±3mil ±2mil
    • Tolerance of NPTH: ±2mil ±1mil
    • Bow twist: 0.75%(max) 0.5%(max)
    • Hole wall roughness: 1.5mil(max) 1mil(max)
    • Outline tolerance: ±4mil ±3mil for routing
  • PCBA service:
    • Surface-mount
    • Through-hole technologies
    • Hand finish work
    • Thru Hole Selective Solder Capabilities
    • 0201 Placement, Fine Pitch Components (0.10" pitch)
    • BGA Assembly Placement and Rework Capabilities
    • Prototype Assembly
    • Aqueous PCBA Cleaning
    • X-Ray Verified PCBA and Inspection
    • PCBA Test Analysis
    • Box Build Assembly
    • PCBA Manufacturing Consulting
    • Cable and harness Assemblies
  • Rigid board Flex-(Rigid) board
  • Layers: 1-40 layers 0-10/11-14 layers
  • Max.working panel: 508x610(mm) 457x610 or 254x737(mm)
  • Min. line width/spacing 3/3 mil for 0.5oz base copper 3/3 mil for 0.5oz base copper
  • Min. hole size: 0.1mm for laser drill 0.20mm
  • Copper thickness: 12-280um 12-105um
  • Finished board thickness: 0.2-8.0mm 0.071-1.8mm
  • Drill to copper: 7mil(min) /
  • Aspect ratio: 20:01 10:01
  • Impedance control: 5% 10%
  • High voltage test: 4000v /
  • Base materials: CEM1,CEM3,FR1,FR2,
  • FR4,Halogen free FR4,High TG FR-4,Rogers,Getek, Arlon, Nelco,Rcc,Hy-bird, PTFE,etc. PI
  • Normal Surface finish HASL, Lead Free HASL, HASL, Lead Free HASL,
  • ENIG, Imm.Sn, Imm.Ag, ENIG, Imm.Sn, Imm.Ag,
  • OSP, Flash Gold, Hard Gold plated, Gold Finger OSP, Flash Gold, Hard Gold plated, Gold Finger, Silver Slurry
  • Selective surface HASL/LF HASL+Gold Finger, HASL/LF HASL+Gold Finger
  • finish HASL/LF HASL+ENIG, HASL/LF HASL+ENIG
  • ENIG/IMM.Sn/IMM.Ag+G/F ENIG/IMM.Sn/IMM.Ag+G/F
  • ENIG+OSP ENIG+OSP
  • OSP+G/F Silver Slurry+Gold plated
  • Silver Slurry+ENIG
  • Normal IPC-A-600G class 2 IPC-A-600G class 2
  • Advance IPC-A-600G class 3 IPC-A-600G class 3
  • Item Rigid board
  • Normal Advance
  • Inner layer registration: ±3mil
  • Min. solder maks dam: 3mil 2.5mil
  • Tolerance of line width/spacing: ±20% ±10%
  • Tolerance of FBT: ±10% ±8%
  • Min. QFP spacing: 20mil 16mil(not HASL)
  • Tolerance of PTH: ±3mil ±2mil
  • Tolerance of NPTH: ±2mil ±1mil
  • Bow twist: 0.75%(max) 0.5%(max)
  • Hole wall roughness: 1.5mil(max) 1mil(max)
  • Outline tolerance: ±4mil ±3mil for routing
  • Surface-mount
  • Through-hole technologies
  • Hand finish work
  • Thru Hole Selective Solder Capabilities
  • 0201 Placement, Fine Pitch Components (0.10" pitch)
  • BGA Assembly Placement and Rework Capabilities
  • Prototype Assembly
  • Aqueous PCBA Cleaning
  • X-Ray Verified PCBA and Inspection
  • PCBA Test Analysis
  • Box Build Assembly
  • PCBA Manufacturing Consulting
  • Cable and harness Assemblies
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