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Basic Info

Payment Type:	T/T, L/C, D/P, PayPal, Western Union

Product Description

Number of layers: 8(flexible)

Base material thickness: 25um

Copper conductor thickness: 18um

Materials: polyester and polyimide

Copper: RA/ED

Minimum hole diameter: 0.15mm

Minimum line/space width: 0.075mm

Minimum annular ring: 0.1mm

Maximum panel size: 400 x 400mm

Plating: solder, nickel and gold

Volume resistivity: 1 x 1015 (IPC-TM-650 2.5.6.17)

Dissipation factor (1MHz): 0.04 (mil-P55617)

Solder heat resistance: 300°C/10 seconds

Dielectric strength: 5kV (IPC-TM-650 2.5.6.1)

Insulation resistance: 1000mW (IPC-TM-650: 2, 6, 3, 2 at ambient)

Peeling strength (180° direction): 1.0kg/cm (IPC-TM-650 2.4.9)

Flammability: 94 V-0 (UL94)

Surface resistance: 5 x 1012 (IPC-TM-650 2.5.6.17)

Dissipation factor (1MHz): 0.04 (mil-P-55617)

With RoHS Directive-compliant

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