Strive Technology Limited
Strive Technology Limited
Reliable PCBA, OEM and ODM, SMD DIP Components Assembly, FCT Test
  • Reliable PCBA, OEM and ODM, SMD DIP Components Assembly, FCT Test
Reliable PCBA, OEM and ODM, SMD DIP Components Assembly, FCT Test

Reliable PCBA, OEM and ODM, SMD DIP Components Assembly, FCT Test

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T/T in Advance
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Basic Info
Basic Info
Payment Type: T/T in Advance
Product Description
Product Description
  • Quick details:
    • Place of origin: Guangdong, China (Mainland)
    • Base material: FR-4
    • Copper thickness: 2oz
    • Board thickness: 1.6mm
    • Minimum hole size: 0.1mm
    • Minimum line width: 0.1mm
    • Minimum line spacing: 0.1mm
    • Surface finishing: HASL
    • Solder mask color: green 
  • Packing and delivery:
    • Packing: according to customer's requirements           
    • Delivery lead-time: 15-20 days
  • PCB capabilities:
    • Materials: FR-4, CEM-3, CM-1, FR-1, Teflon, aluminum, Rogers, High TG
    • Layers: 1-12
    • Maximum panel size: 540 x 520mm
    • Thickness finished: 0.25-5.0mm
    • Copper thickness: 0.5-5.0oz
    • Minimum line width/spacing: 0.10mm/0.10mm
    • Minimum hole/PAD: 0.1mm/PAD 0.4mm
    • Surface finished: lead-free HASL, immersion gold/tin/silver, OSP, gold finger plating, selective immersion gold, gold plating
    • Controlled impedance: ±10% (min±7Ω)
    • Outline tolerance: CNC routing: ±0.1mm
    • Punching: ±0.15mm
    • Layer to layer excursion: ±0.1mm
    • Minimum legend: 0.15mm
    • Aspect ratio: 10:01
    • Anti-flaming level: 94V-0
    • Electric strength: >1.3kV/mm
    • Peel strength: 1.4N/mm
  • Place of origin: Guangdong, China (Mainland)
  • Base material: FR-4
  • Copper thickness: 2oz
  • Board thickness: 1.6mm
  • Minimum hole size: 0.1mm
  • Minimum line width: 0.1mm
  • Minimum line spacing: 0.1mm
  • Surface finishing: HASL
  • Solder mask color: green 
  • Packing: according to customer's requirements           
  • Delivery lead-time: 15-20 days
  • Materials: FR-4, CEM-3, CM-1, FR-1, Teflon, aluminum, Rogers, High TG
  • Layers: 1-12
  • Maximum panel size: 540 x 520mm
  • Thickness finished: 0.25-5.0mm
  • Copper thickness: 0.5-5.0oz
  • Minimum line width/spacing: 0.10mm/0.10mm
  • Minimum hole/PAD: 0.1mm/PAD 0.4mm
  • Surface finished: lead-free HASL, immersion gold/tin/silver, OSP, gold finger plating, selective immersion gold, gold plating
  • Controlled impedance: ±10% (min±7Ω)
  • Outline tolerance: CNC routing: ±0.1mm
  • Punching: ±0.15mm
  • Layer to layer excursion: ±0.1mm
  • Minimum legend: 0.15mm
  • Aspect ratio: 10:01
  • Anti-flaming level: 94V-0
  • Electric strength: >1.3kV/mm
  • Peel strength: 1.4N/mm
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