Strive Technology Limited
Strive Technology Limited
Small quantity high Tg FR4 PCB, good quality and price
  • Small quantity high Tg FR4 PCB, good quality and price
Small quantity high Tg FR4 PCB, good quality and price

Small quantity high Tg FR4 PCB, good quality and price

Payment Type:
T/T in Advance
Quantity:

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Basic Info
Basic Info
Payment Type: T/T in Advance
Product Description
Product Description
  • Quick details:
    • Place of origin: Guangdong China (mainland)
    • Brand name: STL
    • Model number: STL-F-SHG
    • Base material: FR4
    • Copper thickness: 1oz
    • Board thickness: 1.6mm
    • Minimum hole size: 0.15mm
    • Minimum line width: 0.15mm
    • Minimum line spacing: 0.15mm
    • Surface finishing: lead-free HASL
    • Solder mask color: green
    • OEM orders are welcome
  • Packaging details:
    • Inner: vacuum and plastic bag
    • Outer: standard carton
  • Delivery details: 6 to 10 days
  • PCB capabilities:
    • Materials: FR4, CEM-3, CM-1, FR-1, Teflon, aluminum, Rogers and high Tg
    • Layers: 1 to 12
    • Maximum panel size: 540 x 520mm
    • Thickness finish: 0.25-5.0mm
    • Copper thicknesses: 0.5-5.0oz
    • Minimum line width/spacing: 0.10/0.10mm
    • Minimum hole/PAD: 0.1/0.4mm
    • Surface finished: lead-free HASL, immersion gold/tin/silver, OSP, gold finger plating, selective immersion gold and gold plating
    • Controlled impedance: ±10% (minimum ±7Ω)
    • Outline tolerance CNC routing: ±0.1mm
    • Punching: ±0.15mm
    • Layer to layer excursion: ±0.1mm
    • Min legend: 0.15mm
    • Aspect ratio: 10:01
    • Anti-flaming level: 94V-0
    • Electric strength: >1.3kV/mm
    • Peel strength: 1.4N/mm
  • Place of origin: Guangdong China (mainland)
  • Brand name: STL
  • Model number: STL-F-SHG
  • Base material: FR4
  • Copper thickness: 1oz
  • Board thickness: 1.6mm
  • Minimum hole size: 0.15mm
  • Minimum line width: 0.15mm
  • Minimum line spacing: 0.15mm
  • Surface finishing: lead-free HASL
  • Solder mask color: green
  • OEM orders are welcome
  • Inner: vacuum and plastic bag
  • Outer: standard carton
  • Materials: FR4, CEM-3, CM-1, FR-1, Teflon, aluminum, Rogers and high Tg
  • Layers: 1 to 12
  • Maximum panel size: 540 x 520mm
  • Thickness finish: 0.25-5.0mm
  • Copper thicknesses: 0.5-5.0oz
  • Minimum line width/spacing: 0.10/0.10mm
  • Minimum hole/PAD: 0.1/0.4mm
  • Surface finished: lead-free HASL, immersion gold/tin/silver, OSP, gold finger plating, selective immersion gold and gold plating
  • Controlled impedance: ±10% (minimum ±7Ω)
  • Outline tolerance CNC routing: ±0.1mm
  • Punching: ±0.15mm
  • Layer to layer excursion: ±0.1mm
  • Min legend: 0.15mm
  • Aspect ratio: 10:01
  • Anti-flaming level: 94V-0
  • Electric strength: >1.3kV/mm
  • Peel strength: 1.4N/mm
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