Jasecen International (HK) Co. Ltd
Jasecen International (HK) Co. Ltd
6 layer rigid-flex board with hole size of 0.25mm
  • 6 layer rigid-flex board with hole size of 0.25mm
6 layer rigid-flex board with hole size of 0.25mm

6 layer rigid-flex board with hole size of 0.25mm

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Basic Info
Basic Info
Payment Type: T/T or Western Union
Product Description
Product Description
  • Base material: 1milpi/1miladh/1ozcu+0.3mm FR-4 with 0.5oz.cu
  • Coverlay: 1milPI/1milADH
  • Surface finish: ENIG
  • Application: medial
  • Board types:
    •  Multilayer rigid PCB's up to 18 layers
    •  Flexible and flex-rigid circuits up to 18 layers
    •  Controlled impedance
    •  HDI (high density interconnect)
    •  Blind and Buried via holes
    •  RoHS and UL compliant on request
  • Substrates:
    •  FR4 Standard epoxy and high temp versions
    •  Polyimide, polyester and PET
    •  PTFE (polytetraflourethylene) and Duriod (glass reinforced PTFE composite)
    •  Aluminum based materials
    •  Ceramic and exotic substrates with higher maximum operating temperatures, lower coefficients of expansion and/or higher Tg levels
    • Board options:
      • CNC routing
      • Scoring (V-Grooving)
      • Gold on nickel contact fingers
      • LPSM (liquid photoimageable solder mask) range of colors available
      • Peelable solder mask
      • Screened conductive Inks (carbon)
      • Bare board electrical testing
  • Board finishes:
    •  Immersion silver
    •  Immersion gold
    •  Lead free or HASL (hot air solder leveling)
    •  OSP (organic surface preservative)
    •  Gold finger
    •  Plating gold
    •  Immersion tin
  • We also offer:
    •  PCB design
    •  Circuit layout and drafting
    •  PCB copy
  •  Multilayer rigid PCB's up to 18 layers
  •  Flexible and flex-rigid circuits up to 18 layers
  •  Controlled impedance
  •  HDI (high density interconnect)
  •  Blind and Buried via holes
  •  RoHS and UL compliant on request
  •  FR4 Standard epoxy and high temp versions
  •  Polyimide, polyester and PET
  •  PTFE (polytetraflourethylene) and Duriod (glass reinforced PTFE composite)
  •  Aluminum based materials
  •  Ceramic and exotic substrates with higher maximum operating temperatures, lower coefficients of expansion and/or higher Tg levels
  • Board options:
    • CNC routing
    • Scoring (V-Grooving)
    • Gold on nickel contact fingers
    • LPSM (liquid photoimageable solder mask) range of colors available
    • Peelable solder mask
    • Screened conductive Inks (carbon)
    • Bare board electrical testing
  • CNC routing
  • Scoring (V-Grooving)
  • Gold on nickel contact fingers
  • LPSM (liquid photoimageable solder mask) range of colors available
  • Peelable solder mask
  • Screened conductive Inks (carbon)
  • Bare board electrical testing
  •  Immersion silver
  •  Immersion gold
  •  Lead free or HASL (hot air solder leveling)
  •  OSP (organic surface preservative)
  •  Gold finger
  •  Plating gold
  •  Immersion tin
  •  PCB design
  •  Circuit layout and drafting
  •  PCB copy
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