Jasecen International (HK) Co. Ltd
Products
Products
Jasecen International (HK) Co. Ltd
4-layer multilayer PCBS with lead-free hot air leveling for computer main unit
  • 4-layer multilayer PCBS with lead-free hot air leveling for computer main unit
4-layer multilayer PCBS with lead-free hot air leveling for computer main unit

4-layer multilayer PCBS with lead-free hot air leveling for computer main unit

Get Latest Price
Payment Type:
T/T, Western Union
Quantity:

Your message must be between 20 to 2000 characters

Contact Now
Basic Info
Basic Info
Payment Type: T/T, Western Union
Product Description
Product Description
  • Thickness: 1.6mm
  • Green solder mask
  • Board types:
    •  Multilayer rigid PCB's up to 18 layers
    •  Flexible and flex-rigid circuits up to 18 layers
    •  Controlled Impedance
    •  HDI (high density interconnect)
    •  Blind and Buried via holes
    •  RoHS and UL compliant on request
  • Substrates:
    • FR4 Standard epoxy and high temp versions
    • Polyimide, Polyester and PET
    • PTFE (polytetraflourethylene) and Duriod (glass reinforced PTFE composite)
    • Aluminium based materials
    • Ceramic and exotic substrates with higher maximum operating temperatures, lower coefficients of expansion and/or higher Tg levels
  • Board options:
    •  CNC routing
    •  Scoring (V-grooving)
    •  Gold on nickel contact fingers
    •  LPSM (liquid photoimageable solder mask) range of colors available
    •  Peelable solder mask
    •  Screened conductive Inks (carbon)
    •  Bare board electrical testing
  • Board finishes:
    • Immersion silver
    • Immersion gold
    • Lead free or HASL (hot air solder leveling)
    • OSP (organic surface preservative)
    • Gold finger
    • Plating gold
    • Immersion tin
  • We also offer:
    •  PCB design
    •  Circuit layout and drafting
    •  PCB copy
  •  Multilayer rigid PCB's up to 18 layers
  •  Flexible and flex-rigid circuits up to 18 layers
  •  Controlled Impedance
  •  HDI (high density interconnect)
  •  Blind and Buried via holes
  •  RoHS and UL compliant on request
  • FR4 Standard epoxy and high temp versions
  • Polyimide, Polyester and PET
  • PTFE (polytetraflourethylene) and Duriod (glass reinforced PTFE composite)
  • Aluminium based materials
  • Ceramic and exotic substrates with higher maximum operating temperatures, lower coefficients of expansion and/or higher Tg levels
  •  CNC routing
  •  Scoring (V-grooving)
  •  Gold on nickel contact fingers
  •  LPSM (liquid photoimageable solder mask) range of colors available
  •  Peelable solder mask
  •  Screened conductive Inks (carbon)
  •  Bare board electrical testing
  • Immersion silver
  • Immersion gold
  • Lead free or HASL (hot air solder leveling)
  • OSP (organic surface preservative)
  • Gold finger
  • Plating gold
  • Immersion tin
  •  PCB design
  •  Circuit layout and drafting
  •  PCB copy

    • Send your message to this supplier

    • Ms.  Joy

    • Enter between 20 to 4,000 characters.

    Related Products

    Related Keywords

    Related Keywords
    Related Products
    Product Categories