Jasecen International (HK) Co. Ltd
Products
Products
Jasecen International (HK) Co. Ltd
Mechanical Blind Via and Back Drilling Board with Resin Fill, Inner Copper 2OZ, Outer Copper 4OZ
  • Mechanical Blind Via and Back Drilling Board with Resin Fill, Inner Copper 2OZ, Outer Copper 4OZ
Mechanical Blind Via and Back Drilling Board with Resin Fill, Inner Copper 2OZ, Outer Copper 4OZ

Mechanical Blind Via and Back Drilling Board with Resin Fill, Inner Copper 2OZ, Outer Copper 4OZ

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Basic Info
Basic Info
Payment Type: T/T or Western Union
Product Description
Product Description
  • Material: FR4
  • Thickness: 1.6mm
  • Board types:
    • Multilayer rigid PCBs up to 18 layers
    • Flexible and flex-rigid circuits up to 18 layers
    • Controlled impedance
    • HDI (High-density Interconnect)
    • Blind and buried via holes
    • Certification: UL
    • Compliant  with RoHS Directive
  • Substrates:
    • FR4 standard epoxy and high temperature versions
    • Polyimide, polyester and PET
    • PTFE (Polytetra Fluorethylene) and droid (glass reinforced PTFE composite)
    • Base material: aluminum
    • Ceramic and exotic substrates with higher maximum operating temperature, lower coefficients of expansion and/or higher Tg levels
  • Optional board:
    • CNC routing
    • Scoring (V grooving)
    • Gold on nickel contact fingers
    • LPSM (liquid photo imageable solder mask) range of colors available
    • Peelable solder mask
    • Screened conductive inks (carbon)
    • Bare board electrical testing
  • Board finish:
    • Immersion silver
    • Immersion gold
    • Lead-free or HASL (hot air solder leveling)
    • OSP (organic surface preservative)
    • Golden finger
  • Plating: gold immersion tin
  • We offer:
    • PCB design
    • Circuit layout and drafting
    • PCB copy
  • Multilayer rigid PCBs up to 18 layers
  • Flexible and flex-rigid circuits up to 18 layers
  • Controlled impedance
  • HDI (High-density Interconnect)
  • Blind and buried via holes
  • Certification: UL
  • Compliant  with RoHS Directive
  • FR4 standard epoxy and high temperature versions
  • Polyimide, polyester and PET
  • PTFE (Polytetra Fluorethylene) and droid (glass reinforced PTFE composite)
  • Base material: aluminum
  • Ceramic and exotic substrates with higher maximum operating temperature, lower coefficients of expansion and/or higher Tg levels
  • CNC routing
  • Scoring (V grooving)
  • Gold on nickel contact fingers
  • LPSM (liquid photo imageable solder mask) range of colors available
  • Peelable solder mask
  • Screened conductive inks (carbon)
  • Bare board electrical testing
  • Immersion silver
  • Immersion gold
  • Lead-free or HASL (hot air solder leveling)
  • OSP (organic surface preservative)
  • Golden finger
  • PCB design
  • Circuit layout and drafting
  • PCB copy

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