4-layer HDI Bluetooth PCB board with immersed gold and thickness of 1.6mm

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Basic Info

Payment Type:	T/T or Western Union

Product Description

Multilayer rigid PCB's up to 18 layers

Flexible and flex-rigid circuits up to 18 layers

Controlled Impedance

HDI (high density interconnect)

Blind and buried via holes

RoHS and UL compliant on request

FR4 standard epoxy and high temp versions

Polyimide, polyester and PET
PTFE (polytetrafluorethylene) and Duroid (glass reinforced PTFE composite)

Aluminum based materials

Ceramic and exotic substrates with higher maximum operating temperatures, lower coefficients of expansion and/or higher Tg levels

CNC routing

Scoring (V-grooving)

Gold on nickel contact fingers

LPSM (liquid photo imageable soldermask) range of colors available

Peelable solder mask

Screened conductive inks (carbon)

Bare board electrical testing

Immersion silver

Immersion gold

Lead-free or HASL (hot air solder leveling)

OSP (organic surface preservative)

Gold finger

Plating gold

Immersion tin

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