Shenzhen Rigid PCB, 4-layer ENIG, Immersion Gold, Made of FR4

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Basic Info

Payment Type:	T/T, Western Union

Product Description

Material: FR4

Copper thickness: 1oz

Board thickness: 1.6mm

Minimum line width: ≥0.08mm

Minimum line spacing: ≥0.08mm

Thickness: 2.0

Hole diameter: ≥0.2mm

Green solder mask

Surface technology: lead-free HASL and immersion gold

Board types:

Multilayer rigid PCB's up to 18 layers
Flexible and flex-rigid circuits up to 18 layers

Controlled impedance

HDI (high density interconnect)

Blind and buried via holes

Certification: UL

RoHS Directive-compliant

Substrates:

FR4 standard epoxy and high temp versions
Polyimide, polyester and PET
PTFE (polytetraflourethylene) and duriod (glass reinforced PTFE composite)
Aluminium based materials

Ceramic and exotic substrates with higher maximum operating temperature, lower coefficients of expansion and/or higher Tg levels

Board options:

CNC routing
Scoring (V-grooving)
Gold on nickel contact fingers
LPSM (liquid photoimageable solder mask) range of colours available
Peelable solder mask
Screened conductive inks (carbon)
Bare board electrical testing

Board finishes:

Immersion silver
Immersion gold
Lead free or HASL (hot air solder leveling)
OSP (organic surface preservative)

Can offer PCB design, circuit layout and drafting PCB copy

Multilayer rigid PCB's up to 18 layers

Flexible and flex-rigid circuits up to 18 layers

FR4 standard epoxy and high temp versions

Polyimide, polyester and PET

PTFE (polytetraflourethylene) and duriod (glass reinforced PTFE composite)

Aluminium based materials

CNC routing

Scoring (V-grooving)

Gold on nickel contact fingers

LPSM (liquid photoimageable solder mask) range of colours available

Peelable solder mask

Screened conductive inks (carbon)

Bare board electrical testing

Immersion silver

Immersion gold

Lead free or HASL (hot air solder leveling)

OSP (organic surface preservative)

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