Shenzhen Balancestars Electronic Co. Ltd
Shenzhen Balancestars Electronic Co. Ltd
New product Stars Thermal Grease/Heatsink Compound with High Heat Conductivity, for Electronic
  • New product Stars Thermal Grease/Heatsink Compound with High Heat Conductivity, for Electronic
  • New product Stars Thermal Grease/Heatsink Compound with High Heat Conductivity, for Electronic
  • New product Stars Thermal Grease/Heatsink Compound with High Heat Conductivity, for Electronic
  • New product Stars Thermal Grease/Heatsink Compound with High Heat Conductivity, for Electronic
New product Stars Thermal Grease/Heatsink Compound with High Heat Conductivity, for Electronic
New product Stars Thermal Grease/Heatsink Compound with High Heat Conductivity, for Electronic
New product Stars Thermal Grease/Heatsink Compound with High Heat Conductivity, for Electronic
New product Stars Thermal Grease/Heatsink Compound with High Heat Conductivity, for Electronic

New product Stars Thermal Grease/Heatsink Compound with High Heat Conductivity, for Electronic

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Basic Info
Basic Info
Payment Type: Telegraphic Transfer (TT,T/T)
Product Description
Product Description
  • Applied industries:
    • Electronic and electrical products
    • For example, CPU cooler family electric device, audio visual, power applications and communication device
  • Specifications:
    • Color: silver
    • Thermal conductivity: greater than 1.93W/m-K
    • Thermal impedance: greater than 0.120 in 2/W
    • Specific gravity: greater than 1.7
    • Evaporation: less than 0.001%
    • Bleed: less than 0.05%
    • Dielectric constant A: greater than 5.1
    • Viscosity: no flowing
    • Thixotropic index: 350 ±10
    • Moment beared temperatures: -50 to 240°C
    • Operating temperature: -30 to 180°C
  • Electronic and electrical products
  • For example, CPU cooler family electric device, audio visual, power applications and communication device
  • Color: silver
  • Thermal conductivity: greater than 1.93W/m-K
  • Thermal impedance: greater than 0.120 in 2/W
  • Specific gravity: greater than 1.7
  • Evaporation: less than 0.001%
  • Bleed: less than 0.05%
  • Dielectric constant A: greater than 5.1
  • Viscosity: no flowing
  • Thixotropic index: 350 ±10
  • Moment beared temperatures: -50 to 240°C
  • Operating temperature: -30 to 180°C
  • Components:
    • Silicone compounds: 50%
    • Carbon compounds: 20%
    • Metal oxide compounds: 30%
  • Package optional: aluminum foil bag, mini soft package, syringe package, soft tube and can
  • Silicone compounds: 50%
  • Carbon compounds: 20%
  • Metal oxide compounds: 30%
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    • Enter between 20 to 4,000 characters.

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