Shenzhen Dewanda Electronics Co. Ltd
Shenzhen Dewanda Electronics Co. Ltd
SMT PCB Assembly with 0.5 to 3.0mm Finished Board Thickness
  • SMT PCB Assembly with 0.5 to 3.0mm Finished Board Thickness
SMT PCB Assembly with 0.5 to 3.0mm Finished Board Thickness

SMT PCB Assembly with 0.5 to 3.0mm Finished Board Thickness

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Basic Info
Basic Info
Payment Type: T/T
Product Description
Product Description
  • Key specification/special features:
    • Layers: 1 to 30
    • Materials: FR-4, CEM-1, aluminum, Rogers, taconic, Arlon, Nelco, ATS
    • Finish board thickness: 0.2 to 3.0mm
    • External copper thickness: 35 to 210um
    • Internal copper thickness: 17 to 140um
    • Copper plating hole: 18 to 40um
    • Trace width and line spacing: 0.075/0.1mm (3/4 mils)
    • CNC hole diameter: 0.20mm (minimum)
    • Punching hole diameter: 0.9mm (35 mils) (minimum)
    • Panel dimensions: 610 x 508mm (maximum)
    • Hole position tolerance: 0.075mm
    • Hole dimension tolerance: 0.075 (PTH) and 0.05mm (NPTH)
    • Outline tolerance: 0.125 (CNS) and 0.15mm (punching)
    • Warp and twist: 0.70%
    • Solder mask bridge: 0.0635mm (minimum)
    • Distance between lines to board bridge: 0.25 (minimum) (outline) and 0.40mm (v-cut)
    • Impedance control tolerance: ±10%
    • Test voltages: 10 to 300V
    • Solder mask type: green, yellow, red, white, blue and more
    • Surface finished: HASL, immersion gold, immersion silver, gold-plated, gold finger and OSP
  • Layers: 1 to 30
  • Materials: FR-4, CEM-1, aluminum, Rogers, taconic, Arlon, Nelco, ATS
  • Finish board thickness: 0.2 to 3.0mm
  • External copper thickness: 35 to 210um
  • Internal copper thickness: 17 to 140um
  • Copper plating hole: 18 to 40um
  • Trace width and line spacing: 0.075/0.1mm (3/4 mils)
  • CNC hole diameter: 0.20mm (minimum)
  • Punching hole diameter: 0.9mm (35 mils) (minimum)
  • Panel dimensions: 610 x 508mm (maximum)
  • Hole position tolerance: 0.075mm
  • Hole dimension tolerance: 0.075 (PTH) and 0.05mm (NPTH)
  • Outline tolerance: 0.125 (CNS) and 0.15mm (punching)
  • Warp and twist: 0.70%
  • Solder mask bridge: 0.0635mm (minimum)
  • Distance between lines to board bridge: 0.25 (minimum) (outline) and 0.40mm (v-cut)
  • Impedance control tolerance: ±10%
  • Test voltages: 10 to 300V
  • Solder mask type: green, yellow, red, white, blue and more
  • Surface finished: HASL, immersion gold, immersion silver, gold-plated, gold finger and OSP
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