Multilayer PCB with 6 Layers, HDI Board and ENIG Surface Finishing

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Basic Info

Payment Type:	T/T

Product Description

Key Specifications:

10-layer HDI-rigid
Material: FR4
Thickness board: 1.6 mm, ±10%
Outer finish copper: 50um
Inner copper: 35um
L/W: 5/5mil
Minimum holes: 0.2mm
IPC-2
Surface: ENIG
100% E-test
Technology: blind vias, buried vias, selective plating and micro vias (laser drill)

10-layer HDI-rigid

Material: FR4

Thickness board: 1.6 mm, ±10%

Outer finish copper: 50um

Inner copper: 35um

L/W: 5/5mil

Minimum holes: 0.2mm

IPC-2

Surface: ENIG

100% E-test

Technology: blind vias, buried vias, selective plating and micro vias (laser drill)

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