High density multilayer PCB with buried and blind micro vias

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Basic Info

Payment Type:	T/T

Product Description

Key specifications：

8-layer high-density

Material: FR-4

Thickness board: 1.6mm

Outer finish copper: 50um

Inner copper: 35um

L/W: 5/5mil

Min holes: 0.2mm with 0.1mm laser

Surface: HASL LF

No MOQ

Maximum of two extra circuits at no extra charge

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