12-layer high-density PCB, high Tg, 2.4 board thickness

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Basic Info

Payment Type:	T/T

Product Description

Key specifications:

Craft ability table:

Base material: FR-4

Board thickness: 1.6mm

Layers: 12

Minimum line width/spacing: 4Mil

Minimum hole diameter: 0.3mm

Finish copper thickness: 1oz

Surface finish: ENIG

Solder mask: Green

Minimum line width/spacing: 0.075/0.075mm

Minimum solder mask dam: 0.075mm

Minimum and maximum board thicknesses: 0.2-3.5mm

Maximum finish copper thicknesses: 0.5-4oz

Impedance control: ±8%

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