Chengxi Technology (Hong Kong) Company Limited
Chengxi Technology (Hong Kong) Company Limited
FPC Module, Electrolytic Copper with Immersion Gold
  • FPC Module, Electrolytic Copper with Immersion Gold
FPC Module, Electrolytic Copper with Immersion Gold

FPC Module, Electrolytic Copper with Immersion Gold

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Basic Info
Basic Info
Payment Type: Telegraphic Transfer (TT,T/T)
Product Description
Product Description
  • Layers: 2
  • Base material: 1oz Cu/25mm PI/25mm ADH
  • Electrolytic copper
  • Coverlay: 1 mil PI/1 mil ADH
  • Stiffener: no
  • Surface finishing: immersion gold
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