4 Layer PCB, 2.4mm, 1/1oz, Minimum Track 3mil, Minimum Hole Size 0.2mm, Green Solar mask, HAL Lead F
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PCB Assembly for Bluetooth Headset, 20/15/12 Mils Pitch and 0402 Placement
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1.6mm 4-layer PCB with Lead Free SMOBC and HASL Finishes, 50μm Maximum Hard Gold Thickness
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4-layers PCB with 0.8mm Thickness, Blue Solder Mask and Immersion Gold, Measures 1,000 x 1,200mm
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FR4 TG180 1.6mm 6-layer PCB with Immersion Gold Finish, Suitable for Industry Test and Control
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PCB Assembly for Bluetooth Headset, 20/15/12 Mils Pitch and 0402 Placement
1.6mm 4-layer PCB with Lead Free SMOBC and HASL Finishes, 50μm Maximum Hard Gold Thickness
4-layers PCB with 0.8mm Thickness, Blue Solder Mask and Immersion Gold, Measures 1,000 x 1,200mm
FR4 TG180 1.6mm 6-layer PCB with Immersion Gold Finish, Suitable for Industry Test and Control
Four-layer PCB, Maximum Size of 1,000 x 1,200mm; HASL(lead Free), 2-ounce Copper
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FR4 TG180 1.6mm 6-layer PCB with Immersion Gold Finish, Suitable for Industry Test and Control
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4-layers PCB with 0.8mm Thickness, Blue Solder Mask and Immersion Gold, Measures 1,000 x 1,200mm
