ABP Electronics Limited
ABP Electronics Limited
4-layered PCB with 2.4mm Board Thickness and 1,000 x 1,200mm Maximum Size
  • 4-layered PCB with 2.4mm Board Thickness and 1,000 x 1,200mm Maximum Size
4-layered PCB with 2.4mm Board Thickness and 1,000 x 1,200mm Maximum Size

4-layered PCB with 2.4mm Board Thickness and 1,000 x 1,200mm Maximum Size

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T/T
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Basic Info
Basic Info
Payment Type: T/T
Product Description
Product Description
  • PCB technical capacity:
    • Base materials: high-temperature FR4/FR5, halogen-free FR4,aluminum based, polyamide, Rogers, Arlon and other Teflon/PTFE
    • Layers: 1 to 30 layers standard PCB, blind vias and buried viasboard
    • Minimum track space: 4/4 and 3 mils partial allowed
    • Maximum size: 1,000 x 1,200mm
    • Minimum size: 3 x 3mm
    • Surface copper thickness:
      • Maximum: 6/6oz
      • Minimum: 0.5/0.5oz
    • Hard gold thickness: 50u-inch (maximum)
    • Maximum board thickness: 6.0mm
    • Finishes: SMOBC/HASL, lead-free SMOBC/HASL, organic OSP, hardand soft gold, plating tin, immersion silver, immersion tin andelectroless nickel/immersion gold
  • Base materials: high-temperature FR4/FR5, halogen-free FR4,aluminum based, polyamide, Rogers, Arlon and other Teflon/PTFE
  • Layers: 1 to 30 layers standard PCB, blind vias and buried viasboard
  • Minimum track space: 4/4 and 3 mils partial allowed
  • Maximum size: 1,000 x 1,200mm
  • Minimum size: 3 x 3mm
  • Surface copper thickness:
    • Maximum: 6/6oz
    • Minimum: 0.5/0.5oz
  • Hard gold thickness: 50u-inch (maximum)
  • Maximum board thickness: 6.0mm
  • Finishes: SMOBC/HASL, lead-free SMOBC/HASL, organic OSP, hardand soft gold, plating tin, immersion silver, immersion tin andelectroless nickel/immersion gold
  • Maximum: 6/6oz
  • Minimum: 0.5/0.5oz
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