FR4 power bank PCB fabrication with ENIG treatment
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- Layer count: 1-24 layers
- Material: (normal or high) FR4, aluminum base, CEM-3, Rogers and more
- Surface finishing: lead-free HASL, green solder mask, ENIG
- Certificates: UL, RoHS and SGS
- Package: vacuum packing, carton package, anti-static packing
- Excellent service
- Low-cost
- Quality approvals
- No MOQ
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Quick-turnaround/Multilayer PCB with ENIG Surface and Impedance Control
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Quick-turnaround PCB with 2 Layers, 24 Hours Lead Time and 0.5mm Board Thickness
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Wireless Multilayer PCB with 6 Layers, 0.2mm Minimum Drill Size and 0.12/0.12mm Minimum Width/Gap
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Thin Quick Turnaround PCB with FR4 0.2mm and 0.17/0.17mm Minimum Width/Gap
Related Keywords
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Quick-turnaround/Multilayer PCB with ENIG Surface and Impedance Control
Quick-turnaround PCB with 2 Layers, 24 Hours Lead Time and 0.5mm Board Thickness
Wireless Multilayer PCB with 6 Layers, 0.2mm Minimum Drill Size and 0.12/0.12mm Minimum Width/Gap
Thin Quick Turnaround PCB with FR4 0.2mm and 0.17/0.17mm Minimum Width/Gap
Quick-turnaround PCB with 8 Layers and 1.0mm Finished Board Thickness
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Quick-turnaround/Multilayer PCB with ENIG Surface and Impedance Control
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